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MCF5213CAF66

NXP Semiconductors

MCF5213CAF66 by NXP Semiconductors

The NXP Semiconductors MCF5213CAF66 is a 32-bit microcontroller with 48 MHz clock frequency, 56 I/O lines, and Flash ROM programmability. It is used in industrial applications due to its -40 to 85 °C operating temperature range and CMOS technology. The microcontroller features ADC and DMA channels for versatile functionality.

Median Price

$34.060

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

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Chip1Stop

Japan . 48 parts In-Stock

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$26.770

100+ parts

$16.340

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48

$26.770

$16.340

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Arrow

USA . 380 parts In-Stock

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$34.060

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$21.970

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380

$34.060

$21.970

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Verical

USA . 380 parts In-Stock

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$34.060

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380

$34.060

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DigiKey

USA . 236 parts In-Stock

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$34.390

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$24.459

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Avnet

USA . 1,440 parts In-Stock

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Nova Conductors

Japan . 200 parts In-Stock

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$21.123

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Digiode

USA . 784 parts In-Stock

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$25.432

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Chip Stock

USA . 2,942 parts In-Stock

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Anansix

USA . 2,019 parts In-Stock

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TME

Poland . 450 parts In-Stock

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$25.844

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$25.844

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Vyrian

USA . 156 parts In-Stock

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Semicontronic

India . 337 parts In-Stock

1+ parts

$15.860

100+ parts

$15.464

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$15.384

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337

$15.860

$15.464

$15.384

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Advanced Electronics

New Zealand . 83 parts In-Stock

1+ parts

$16.659

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$15.826

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$15.826

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83

$16.659

$15.826

$15.826

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Aranea Global

USA . 2,000 parts In-Stock

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$20.701

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$19.872

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$20.701

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$19.872

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Continental Prestige Electronics

USA . 5,289 parts In-Stock

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$21.123

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$20.701

5,289

$21.123

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$20.701

Ampacity Inc.

Singapore . 226 parts In-Stock

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$22.750

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One Stop Electronics

USA . 115 parts In-Stock

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$22.750

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Corphita

USA . 2,236 parts In-Stock

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$24.093

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Vigor

Singapore . 1,594 parts In-Stock

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$24.440

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Corohmni

South Africa . 196 parts In-Stock

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$59.702

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196

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Aztec Data Supply Inc.

USA . 2,799 parts In-Stock

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$76.370

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$76.370

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Microchip USA

USA . 709 parts In-Stock

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$105.248

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Authorized Procurement Solutions

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Lixinc

USA . 7,715 parts In-Stock

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UNI Independent Distributors

Spain . 7,249 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,000 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Argo Parts USA

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Perfect Parts

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Overview

Get ready to experience top-of-the-line performance with the MCF5213CAF66 microcontroller by NXP Semiconductors. This innovative device boasts unrivaled quality and reliability, making it the perfect choice for a wide range of applications. From industrial automation to consumer electronics, this microcontroller delivers exceptional value, efficiency, and precision. Say goodbye to compromise and hello to cutting-edge technology with the MCF5213CAF66. Elevate your projects to new heights with this game-changing microcontroller!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability, making the microcontroller suitable for various applications.

Surface Mount: YES

This feature allows for easy installation onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power inputs.

Package Shape: SQUARE

The square shape of the package offers efficient use of space on a circuit board.

Bit Size: 32

The 32-bit architecture provides enhanced processing power for complex tasks and applications.

No. of Terminals: 100

The abundance of terminals allows for versatile connectivity options with other components.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a compact design, making it ideal for space-constrained applications.

Minimum Supply Voltage: 3 V

This microcontroller can operate efficiently with low power inputs, saving energy.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in harsh environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the microcontroller to function in extreme cold conditions.

Terminal Finish: TIN

The tin finish on the terminals provides good conductivity and corrosion resistance for long-term use.

ADC Channels: YES

The built-in analog-to-digital converter channels enable the microcontroller to process analog signals accurately.

DMA Channels: YES

The direct memory access channels enhance data transfer speeds and efficiency, improving overall performance.

Terminal Position: QUAD

The quad terminal position offers stability and reliability in connections with external components.

Maximum Seated Height: 1.7 mm

The low seated height allows for a compact overall design of the microcontroller system.

Width: 14 mm

The width of 14mm provides a compact form factor, suitable for applications with limited space.

Maximum Clock Frequency: 48 MHz

The high clock frequency enables fast processing speeds for time-critical applications.

Maximum Time At Peak Reflow Temperature: 40s

The short reflow time at peak temperature ensures proper soldering without damaging the microcontroller.

Peak Reflow Temperature: 260 °C

The high peak reflow temperature tolerance ensures reliable soldering during assembly.

Length: 14 mm

The length of 14mm complements the compact design of the microcontroller unit.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures the microcontroller can withstand demanding operating conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller offers efficient processing and reduced power consumption.

Technology: CMOS

The CMOS technology provides low power consumption and high noise immunity for reliable performance.

Terminal Form: GULL WING

The gull-wing terminal form offers secure connections and ease of soldering during assembly.

Nominal Supply Voltage: 3.3 V

The stable nominal supply voltage ensures consistent performance of the microcontroller in various applications.

PWM Channels: YES

The pulse-width modulation channels allow precise control of output signals, essential for many applications.

ROM Programmability: FLASH

The flash programmable ROM provides flexibility for firmware updates and customization of the microcontroller.

Terminal Pitch: 0.5 mm

The narrow terminal pitch allows for high-density mounting on circuit boards, saving space.

Moisture Sensitivity Level: 3

The moisture sensitivity level indicates the level of protection needed during PCB storage and assembly.

Speed: 66 rpm

The 66 rpm speed rating makes this microcontroller suitable for real-time applications with quick response times.

No. of I/O Lines: 56

The abundant input/output lines enable versatile connectivity with external devices and sensors.

Technical Specifications

Microcontrollers MCF5213CAF66 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

56

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

66 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MCF5213CAF66 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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