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MCF5216CVM66

NXP Semiconductors

MCF5216CVM66 by NXP Semiconductors

NXP Semiconductors' MCF5216CVM66 microcontroller operates at 66.67 MHz with a 32-bit external data bus width. It features 142 I/O lines, ADC and DMA channels, and flash ROM programmability. Ideal for industrial applications due to its -40 to 85 °C operating temperature range and low profile grid array package style.

Median Price

$49.000

Lifecycle Status

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14

In-Stock Inventory

1k+

MCF5216CVM66 by NXP Semiconductors
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Chip1Stop

Japan . 370 parts In-Stock

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$49.000

100+ parts

$35.400

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-

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370

$49.000

$35.400

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Arrow

USA . 98 parts In-Stock

1+ parts

$64.380

100+ parts

$43.050

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-

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98

$64.380

$43.050

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DigiKey

USA . 256 parts In-Stock

1+ parts

$64.880

100+ parts

$49.136

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256

$64.880

$49.136

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Avnet

USA . 360 parts In-Stock

1+ parts

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EBV Elektronik

Germany . 360 parts In-Stock

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360

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Verical

USA . 270 parts In-Stock

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$44.934

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270

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$44.934

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Rochester

USA . 1 parts In-Stock

1+ parts

-

100+ parts

$42.360

1k+ parts

$37.900

10k+ parts

$35.670

1

-

$42.360

$37.900

$35.670

Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$37.064

100+ parts

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50

$37.064

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Digiode

USA . 2,498 parts In-Stock

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$37.259

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$37.259

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Anansix

USA . 1,919 parts In-Stock

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Flip Electronics

USA . 1,312 parts In-Stock

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Chip Stock

USA . 1,125 parts In-Stock

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TME

Poland . 384 parts In-Stock

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$57.490

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$57.490

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Vyrian

USA . 157 parts In-Stock

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Semicontronic

India . 276 parts In-Stock

1+ parts

$33.340

100+ parts

$32.506

1k+ parts

$32.340

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276

$33.340

$32.506

$32.340

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Ampacity Inc.

Singapore . 207 parts In-Stock

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$33.340

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$33.340

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Corphita

USA . 3,770 parts In-Stock

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$35.298

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3,770

$35.298

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Bastille Electronics

Australia . 500 parts In-Stock

1+ parts

$37.060

100+ parts

$35.207

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$32.983

500

$37.060

$35.207

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$32.983

Continental Prestige Electronics

USA . 2,678 parts In-Stock

1+ parts

$37.064

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$36.323

2,678

$37.064

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$36.323

Vigor

Singapore . 9,670 parts In-Stock

1+ parts

$50.730

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$50.730

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Corohmni

South Africa . 421 parts In-Stock

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$50.746

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Aztec Data Supply Inc.

USA . 131 parts In-Stock

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$51.309

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Microchip USA

USA . 1,202 parts In-Stock

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$127.627

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Lixinc

USA . 10,071 parts In-Stock

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Authorized Procurement Solutions

USA . 9,000 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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UNI Independent Distributors

Spain . 1,868 parts In-Stock

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Perfect Parts

USA . 600 parts In-Stock

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Kepictronics

USA . 482 parts In-Stock

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Argo Parts USA

USA . 327 parts In-Stock

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iodParts Technologies Inc.

India . 150 parts In-Stock

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Overview

Unlock the power of innovation with the NXP Semiconductors MCF5216CVM66 microcontroller. Designed with cutting-edge technology and reliable performance, this device is perfect for a wide range of applications in various industries. From industrial automation to consumer electronics, this microcontroller offers unmatched value with its high-quality construction and advanced features. Experience seamless functionality and enhanced efficiency with the MCF5216CVM66, the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

The surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and space.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options, accommodating a wide range of applications.

Address Bus Width: 24

The 24-bit address bus width provides a large address space, allowing for more memory and data storage capacity.

Package Shape: SQUARE

The square package shape is compact and space-efficient, ideal for applications where board space is limited.

No. of Terminals: 256

With 256 terminals, this microcontroller can support a wide range of input and output connections, enhancing its versatility.

Package Style (Meter): GRID ARRAY, LOW PROFILE

The grid array, low profile package style offers reliable connections and a compact design, making it suitable for tight spaces.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage ensures efficient power consumption and compatibility with a variety of power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows the microcontroller to function reliably in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the microcontroller can operate in cold environments without any issues.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper for terminal finish provides good conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to convert analog signals to digital, enabling a wide range of sensor and input compatibility.

DMA Channels: YES

The availability of DMA channels allows for efficient data transfer and communication between peripherals, improving overall system performance.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy and secure mounting on circuit boards, ensuring a stable connection.

Maximum Seated Height: 1.6 mm

The low seated height allows for a compact design, making it suitable for applications where space is limited.

Width: 17 mm

The compact width makes the microcontroller suitable for small form factor applications, where space is a constraint.

External Data Bus Width: 32

The 32-bit external data bus width allows for high-speed data transfer, enhancing the overall performance of the microcontroller.

Maximum Clock Frequency: 66.67 MHz

The high maximum clock frequency enables fast processing speeds, making the microcontroller suitable for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 40

The short time at peak reflow temperature ensures that the microcontroller is not subjected to excessive heat stress during assembly, ensuring its reliability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for robust soldering processes, ensuring secure connections during assembly.

Length: 17 mm

The compact length of the microcontroller makes it suitable for applications with space constraints, without compromising on functionality.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the microcontroller can operate reliably in harsh industrial environments without any issues.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller offers efficient and fast processing capabilities, making it suitable for high-performance applications.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Terminal Form: BALL

The ball terminal form provides secure connections and facilitates easy soldering during assembly, ensuring a reliable electrical connection.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V offers compatibility with standard power sources, ensuring ease of integration into various systems.

PWM Channels: YES

The availability of PWM channels allows for precise control of analog outputs, making the microcontroller suitable for motor control and power management applications.

ROM Programmability: FLASH

The flash ROM programmability allows for easy and efficient programming of the microcontroller, enabling firmware updates and customization.

Terminal Pitch: 1 mm

The 1mm terminal pitch facilitates easy PCB layout and assembly, ensuring a secure and reliable connection between the microcontroller and other components.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that the microcontroller is suitable for reflow soldering processes and has a moderate level of moisture sensitivity.

Speed: 66.67 rpm

The high speed of 66.67 rpm enables fast data processing and communication, making the microcontroller ideal for applications requiring high-speed operation.

No. of I/O Lines: 142

With 142 I/O lines, this microcontroller offers a large number of input and output options, allowing for versatile connectivity and functionality.

Technical Specifications

Microcontrollers MCF5216CVM66 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

24

Maximum Clock Frequency:

66.67 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

142

No. of Terminals:

256

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

66.67 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

17 mm

Peripheral IC Type:

Trade Compliance

MCF5216CVM66 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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