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MCF51AC256ACFUE

NXP Semiconductors

MCF51AC256ACFUE by NXP Semiconductors

MCF51AC256ACFUE by NXP Semiconductors is a 32-bit microcontroller with a max clock frequency of 16 MHz. It has 54 I/O lines and can operate in industrial temperature conditions (-40 to 85 °C). This microcontroller is commonly used in applications requiring high-speed processing and extensive input/output capabilities.

Median Price

$14.425

Lifecycle Status

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9

In-Stock Inventory

1k+

MCF51AC256ACFUE by NXP Semiconductors
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Mouser Electronics

USA . 834 parts In-Stock

1+ parts

$22.620

100+ parts

$15.240

1k+ parts

$13.390

10k+ parts

-

834

$22.620

$15.240

$13.390

-

Rochester

USA . 1,737 parts In-Stock

1+ parts

-

100+ parts

$11.540

1k+ parts

$10.330

10k+ parts

$9.720

1,737

-

$11.540

$10.330

$9.720

Verical

USA . 1,635 parts In-Stock

1+ parts

-

100+ parts

$14.425

1k+ parts

$12.912

10k+ parts

$12.150

1,635

-

$14.425

$12.912

$12.150

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$13.065

100+ parts

-

1k+ parts

-

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300

$13.065

-

-

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Digiode

USA . 2,928 parts In-Stock

1+ parts

$19.950

100+ parts

-

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-

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2,928

$19.950

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Chip Stock

USA . 965 parts In-Stock

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965

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Anansix

USA . 834 parts In-Stock

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834

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Vyrian

USA . 250 parts In-Stock

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250

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Flip Electronics

USA . 102 parts In-Stock

1+ parts

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102

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Semicontronic

India . 284 parts In-Stock

1+ parts

$11.020

100+ parts

$10.744

1k+ parts

$10.689

10k+ parts

-

284

$11.020

$10.744

$10.689

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One Stop Electronics

USA . 187 parts In-Stock

1+ parts

$11.020

100+ parts

-

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187

$11.020

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Ampacity Inc.

Singapore . 35 parts In-Stock

1+ parts

$11.020

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35

$11.020

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Continental Prestige Electronics

USA . 6,839 parts In-Stock

1+ parts

$13.065

100+ parts

-

1k+ parts

-

10k+ parts

$12.804

6,839

$13.065

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-

$12.804

Netroflash

USA . 100 parts In-Stock

1+ parts

$13.065

100+ parts

-

1k+ parts

$12.412

10k+ parts

$12.150

100

$13.065

-

$12.412

$12.150

Advanced Electronics

New Zealand . 38 parts In-Stock

1+ parts

$15.103

100+ parts

$13.895

1k+ parts

$13.020

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38

$15.103

$13.895

$13.020

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Aztec Data Supply Inc.

USA . 1,000 parts In-Stock

1+ parts

$17.032

100+ parts

-

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1,000

$17.032

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Corphita

USA . 4,733 parts In-Stock

1+ parts

$18.900

100+ parts

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4,733

$18.900

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Microchip USA

USA . 1,482 parts In-Stock

1+ parts

$33.518

100+ parts

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1,482

$33.518

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Corohmni

South Africa . 886 parts In-Stock

1+ parts

$70.134

100+ parts

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886

$70.134

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QUARKTWIN TECHNOLOGY LTD

USA . 26,526 parts In-Stock

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26,526

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A-Z Elektronik GmbH

Germany . 6,624 parts In-Stock

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6,624

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UNI Independent Distributors

Spain . 5,380 parts In-Stock

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Argo Parts USA

USA . 4,421 parts In-Stock

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Kepictronics

USA . 3,500 parts In-Stock

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3,500

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Robosynatics

Brazil . 1,733 parts In-Stock

1+ parts

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100+ parts

$26.299

1k+ parts

$25.763

10k+ parts

$25.763

1,733

-

$26.299

$25.763

$25.763

Lucentia Tech

USA . 1,733 parts In-Stock

1+ parts

-

100+ parts

$26.299

1k+ parts

$25.763

10k+ parts

$25.763

1,733

-

$26.299

$25.763

$25.763

Overview

Experience the next level of innovation with the MCF51AC256ACFUE microcontroller by NXP Semiconductors. Known for their exceptional quality and reliability, NXP Semiconductors brings you a groundbreaking solution that will revolutionize your applications. With its wide range of features and advanced technology, this microcontroller offers unparalleled value and benefits to customers. From its powerful performance to its versatile applications, the MCF51AC256ACFUE is designed to exceed expectations. Discover endless possibilities and unlock the true potential of your projects with this cutting-edge product. Embrace the future of microcontrollers with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's plastic/epoxy body material offers durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

The surface mount capability of this microcontroller simplifies the PCB assembly process, saving time and effort during production.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this microcontroller can operate efficiently in systems that require a higher voltage range.

Package Shape: SQUARE

The square package shape allows for easy integration and placement on the PCB, optimizing space utilization and improving overall design flexibility.

Bit Size: 32

The 32-bit architecture of this microcontroller provides enhanced computational capabilities, enabling faster and more complex operations.

Power Supplies (V): 3/5

Supporting both 3V and 5V power supplies, this microcontroller offers compatibility with a wide range of electronic systems, increasing its versatility.

No. of Terminals: 64

With a sufficient number of terminals, this microcontroller can accommodate various external connections, facilitating seamless integration with peripheral devices.

Package Style (Meter): FLATPACK

The flatpack package style ensures easy installation and reliable soldering, enhancing the long-term performance and stability of the microcontroller.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage requirement allows this microcontroller to be powered by energy-efficient sources, contributing to overall power savings.

Maximum Operating Temperature: 85 °C

Capable of operating reliably under high temperatures, up to 85°C, this microcontroller is suitable for demanding industrial environments.

CPU Family: COLDFIRE

With the ColdFire CPU family, this microcontroller delivers optimized performance for applications requiring efficient data processing and control capabilities.

Minimum Operating Temperature: -40 °C

Designed to withstand extremely low temperatures, down to -40°C, this microcontroller is suitable for use in harsh environments.

Terminal Finish: TIN

The tin terminal finish provides excellent solderability, ensuring strong and reliable interconnections, even under challenging conditions.

ADC Channels: YES

Featuring analog-to-digital converter channels, this microcontroller can accurately measure and convert analog signals, expanding its applicability in various sensor-based systems.

Terminal Position: QUAD

With a quad terminal position, this microcontroller can be easily mounted and secured, ensuring reliable electrical connections and improved stability.

ROM Words: 262144

The large ROM capacity of 262144 words allows for extensive program storage, enabling the microcontroller to handle complex tasks and data storage requirements.

Maximum Seated Height: 2.45 mm

The compact maximum seated height of 2.45 mm minimizes the overall profile of the microcontroller, making it suitable for compact designs with space constraints.

Width: 14 mm

With a slim width of 14 mm, this microcontroller optimizes board space utilization and facilitates compact system design.

Maximum Clock Frequency: 16 MHz

Operating at a maximum clock frequency of 16 MHz, this microcontroller enables fast and efficient data processing, accelerating system performance.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time at peak reflow temperature of 40 seconds ensures proper soldering and component attachment during manufacturing processes.

Peak Reflow Temperature °C: 260

Capable of withstanding high peak reflow temperatures up to 260°C, this microcontroller exhibits excellent thermal resilience during manufacturing processes.

Length: 14 mm

With a compact length of 14 mm, this microcontroller can be easily integrated into space-constrained designs while maintaining optimal functionality.

Temperature Grade: INDUSTRIAL

Designed to meet industrial temperature grade requirements, this microcontroller can operate reliably in harsh temperature conditions, ensuring system stability.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, this product integrates various peripheral functions, enabling it to handle diverse tasks and effectively control associated devices.

RAM Bytes: 32768

With a generous RAM capacity of 32768 bytes, this microcontroller provides ample storage for variables, data buffers, and stack operations, supporting efficient data handling.

Technology: CMOS

Utilizing CMOS technology, this microcontroller offers low power consumption, high noise immunity, and compatibility with a wide range of electronic systems.

Terminal Form: GULL WING

The gull wing terminal form simplifies the assembly process, enabling easy soldering and facilitating reliable electrical connections during production.

Nominal Supply Voltage: 5 V

Designed for compatibility with 5V nominal supply voltage systems, this microcontroller can seamlessly integrate into various electronic applications.

PWM Channels: YES

Equipped with pulse-width modulation (PWM) channels, this microcontroller enables precise control of analog output signals, making it suitable for motor control and power conversion applications.

ROM Programmability: FLASH

With flash programmability, this microcontroller allows for easy and flexible firmware updates, providing enhanced versatility and supporting future system modifications.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8 mm facilitates fine-pitch PCB layouts, enabling higher-density designs and improved overall system integration.

Moisture Sensitivity Level (MSL): 3

Rated with an MSL of 3, this microcontroller exhibits moderate moisture sensitivity, requiring standard storage and handling precautions during manufacturing.

Speed: 50.33 rpm

Though not explicitly mentioned as a technical spec, this microcontroller's speed capability of 50.33 rpm ensures efficient processing and response times, making it suitable for time-critical applications.

No. of I/O Lines: 54

With a generous number of input/output lines, this microcontroller offers ample connectivity options for interfacing with external devices and sensors, enhancing system flexibility.

Technical Specifications

Microcontrollers MCF51AC256ACFUE attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

COLDFIRE

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

54

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.66SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

2.45 mm

Speed:

50.33 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MCF51AC256ACFUE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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