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MC68HC11E0CFNE2

NXP Semiconductors

MC68HC11E0CFNE2 by NXP Semiconductors

MC68HC11E0CFNE2 by NXP Semiconductors is an 8-bit microcontroller with a clock frequency of 8 MHz, 16-bit address bus width, and 38 I/O lines. It is used in industrial applications due to its HCMOS technology, operating temperature range of -40 to 85 °C, and package style of chip carrier.

Median Price

$32.195

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Nova Conductors

Japan . 300 parts In-Stock

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$17.431

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Flip Electronics

USA . 1,290 parts In-Stock

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$46.960

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Digiode

USA . 2,193 parts In-Stock

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Vyrian

USA . 1,557 parts In-Stock

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Anansix

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Chip Stock

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Q Components

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ComSIT Distribution GmbH

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Distributors (Availability)

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Ampacity Inc.

Singapore . 223 parts In-Stock

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$2.000

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One Stop Electronics

USA . 1,972 parts In-Stock

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$9.000

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$9.000

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Semicontronic

India . 1,496 parts In-Stock

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$10.000

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$9.750

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$9.700

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AZTECH Wire

Italy . 855 parts In-Stock

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$14.329

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Continental Prestige Electronics

USA . 4,183 parts In-Stock

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$17.431

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$17.082

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Netroflash

USA . 100 parts In-Stock

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$17.431

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$16.559

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$16.211

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Microchip USA

USA . 410 parts In-Stock

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$25.688

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$29.318

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$27.852

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Corohmni

South Africa . 85 parts In-Stock

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$32.728

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Aztec Data Supply Inc.

USA . 1,152 parts In-Stock

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$47.980

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QUARKTWIN TECHNOLOGY LTD

USA . 23,537 parts In-Stock

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UNI Independent Distributors

Spain . 5,565 parts In-Stock

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S.R.D Solutions

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Corphita

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Argo Parts USA

USA . 1,597 parts In-Stock

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Authorized Procurement Solutions

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Perfect Parts

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A-Z Elektronik GmbH

Germany . 170 parts In-Stock

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GreenTree Electronics

Israel . 100 parts In-Stock

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Kepictronics

USA . 85 parts In-Stock

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Overview

Experience the ultimate in performance and reliability with the MC68HC11E0CFNE2 microcontroller by NXP Semiconductors. As a leader in semiconductor technology, NXP delivers cutting-edge solutions for a wide range of applications. This versatile chip offers high-quality design and exceptional functionality, making it the perfect choice for your next project. Whether you're working on automotive systems, industrial controls, or consumer electronics, the MC68HC11E0CFNE2 provides unmatched value and efficiency. Upgrade your designs today with NXP Semiconductors!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a cost-effective and durable housing for the microcontroller, making it suitable for a wide range of applications.

Surface Mount: YES

Enables easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 5.5 V

Allows for stable and reliable operation within a safe voltage range.

Address Bus Width: 16

Provides ample address space for memory and peripheral interfacing, enhancing the versatility of the microcontroller.

Package Shape: SQUARE

Facilitates efficient PCB layout and integration, optimizing space usage on the board.

Bit Size: 8

Suitable for handling basic computing tasks and control functions in various embedded applications.

No. of Terminals: 52

Offers a sufficient number of connections for interfacing with external components and peripherals.

Package Style (Meter): CHIP CARRIER

Ensures a compact and reliable package format for improved thermal performance and mechanical robustness.

Minimum Supply Voltage: 4.5 V

Allows for flexibility in different power supply configurations while maintaining stable operation.

Maximum Operating Temperature: 85 °C

Supports reliable performance in a wide range of operating environments, including industrial settings.

Minimum Operating Temperature: -40 °C

Ensures operational reliability even in extreme temperature conditions, making the microcontroller suitable for harsh environments.

Terminal Finish: TIN

Provides a reliable and corrosion-resistant surface for soldering connections, ensuring long-term electrical contact.

ADC Channels: YES

Allows for analog-to-digital conversion, enabling the microcontroller to interface with sensor inputs and other analog signals.

Terminal Position: QUAD

Facilitates efficient PCB layout and routing of signal lines, improving overall performance and reliability.

Maximum Seated Height: 5.08 mm

Offers a low-profile design for compact and space-constrained applications.

Width: 19.125 mm

Provides a compact footprint for easy integration into various system designs.

External Data Bus Width: 8

Suitable for handling data transfers and communication between the microcontroller and external devices.

Maximum Clock Frequency: 8 MHz

Supports fast and efficient processing of instructions and data, enhancing the overall performance of the microcontroller.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper solder reflow process during assembly, leading to reliable and sturdy solder joints.

Peak Reflow Temperature °C: 250

Supports high-temperature soldering processes for reliable and robust connections.

Length: 19.125 mm

Offers a compact form factor for easy integration and space-saving in various electronic applications.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh operating conditions in industrial environments, ensuring reliability and longevity.

Peripheral IC Type: MICROCONTROLLER

Specifically designed for embedded control applications, offering features and functionalities suited for diverse control tasks.

Technology: HCMOS

Utilizes high-speed CMOS technology for efficient performance and low power consumption, ideal for battery-powered applications.

Terminal Form: J BEND

Facilitates easy and reliable mounting on PCBs, ensuring proper mechanical stability and electrical connections.

Nominal Supply Voltage: 5 V

Standard voltage specification for compatibility with common power supply systems and components.

Terminal Pitch: 1.27 mm

Provides a standard pitch for easy soldering and PCB layout, ensuring compatibility with common PCB design practices.

Moisture Sensitivity Level (MSL): 3

Ensures appropriate handling and storage requirements to prevent moisture-induced damage during assembly and operation.

Speed: 2 rpm

Suitable for handling real-time control tasks and data processing with moderate speed requirements.

No. of I/O Lines: 38

Offers a sufficient number of input/output lines for interfacing with external devices and peripherals, enabling versatile control and communication capabilities.

Technical Specifications

Microcontrollers MC68HC11E0CFNE2 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Additional Features:

SEATED HEIGHT CALCULATED

Address Bus Width:

16

Bit Size:

8

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J52

JESD-609 Code:

e3

Length:

19.125 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

38

No. of Terminals:

52

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

250

Maximum Seated Height:

5.08 mm

Speed:

2 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

HCMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

19.125 mm

Peripheral IC Type:

Trade Compliance

MC68HC11E0CFNE2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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