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MC50XS4200BEKR2

NXP Semiconductors

MC50XS4200BEKR2 by NXP Semiconductors

MC50XS4200BEKR2 by NXP Semiconductors is a peripheral driver with 32 terminals, supporting power supplies of 3.3/5,8/36V. It operates in automotive-grade temperatures (-40 to 125°C) and has a max output current of 1.2A. This interface IC type is ideal for buffer or inverter-based applications in the automotive industry.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 740 parts In-Stock

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740

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Vyrian

USA . 641 parts In-Stock

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641

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Digiode

USA . 577 parts In-Stock

1+ parts

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577

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 710 parts In-Stock

1+ parts

$17.014

100+ parts

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710

$17.014

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Microchip USA

USA . 388 parts In-Stock

1+ parts

$18.279

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388

$18.279

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Ampacity Inc.

Singapore . 1,143 parts In-Stock

1+ parts

$25.500

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1,143

$25.500

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One Stop Electronics

USA . 2,109 parts In-Stock

1+ parts

$29.500

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2,109

$29.500

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UNI Independent Distributors

Spain . 5,806 parts In-Stock

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5,806

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Corphita

USA . 3,047 parts In-Stock

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3,047

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Aranea Global

USA . 2,000 parts In-Stock

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2,000

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Overview

Experience unmatched quality and reliability with the MC50XS4200BEKR2 by NXP Semiconductors, a top-tier manufacturer in the industry. This peripheral driver offers exceptional performance in a wide range of applications, ensuring seamless operation and optimal functionality. With its advanced features and cutting-edge technology, this product delivers unparalleled value, benefits, and advantages to customers. Trust NXP Semiconductors to provide innovative solutions that exceed expectations. Elevate your projects with the MC50XS4200BEKR2 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this product lightweight and durable, ideal for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and facilitating automated assembly processes.

Power Supplies (V): 3.3/5,8/36

With multiple voltage options, this peripheral driver can be used in a wide range of systems, providing flexibility and compatibility.

No. of Terminals: 32

Having 32 terminals enables this peripheral driver to connect to multiple external devices or components, expanding its functionality.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability and performance in demanding environments, making it suitable for industrial or automotive applications.

Maximum Output Current: 1.2 A

With a maximum output current of 1.2 A, this peripheral driver can effectively drive various loads, making it versatile and capable of handling different tasks.

Technical Specifications

Peripheral Drivers MC50XS4200BEKR2 attributes and parameters. Explore more Peripheral Drivers devices from NXP Semiconductors

Specs

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1.2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP32,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5,8/36

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

MC50XS4200BEKR2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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