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MC35FS6513CAER2

NXP Semiconductors

MC35FS6513CAER2 by NXP Semiconductors

INTERFACE CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 40; Screening Level: AEC-Q100; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Flip Electronics (Authorized)

USA . 4,000 parts In-Stock

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Flip Electronics

USA . 4,000 parts In-Stock

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Vyrian

USA . 3,586 parts In-Stock

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Anansix

USA . 1,525 parts In-Stock

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Digiode

USA . 621 parts In-Stock

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Nova Conductors

Japan . 15 parts In-Stock

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Corohmni

South Africa . 94 parts In-Stock

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Aztec Data Supply Inc.

USA . 4,246 parts In-Stock

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Microchip USA

USA . 4,260 parts In-Stock

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Ampacity Inc.

Singapore . 3,787 parts In-Stock

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UNI Independent Distributors

Spain . 4,814 parts In-Stock

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Corphita

USA . 3,702 parts In-Stock

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Continental Prestige Electronics

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Argo Parts USA

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Technical Specifications

Network Interfaces MC35FS6513CAER2 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Telecom IC Type:

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

MC35FS6513CAER2 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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