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MC34845DEPR2

NXP Semiconductors

MC34845DEPR2 by NXP Semiconductors

MC34845DEPR2 by NXP Semiconductors is a Graphics Display Driver with 24 terminals, operating voltage range of 5-21V, and industrial temperature grade. It features a square package shape, chip carrier style, and no-lead terminal form. Ideal for LED display driver applications due to its compact size and high max supply voltage capability.

Median Price

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Lifecycle Status

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4

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1k+

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Digiode

USA . 4,096 parts In-Stock

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Anansix

USA . 2,410 parts In-Stock

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Vyrian

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Nova Conductors

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Microchip USA

USA . 138 parts In-Stock

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$10.049

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AZTECH Wire

Italy . 621 parts In-Stock

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Ampacity Inc.

Singapore . 1,293 parts In-Stock

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$17.500

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One Stop Electronics

USA . 2,093 parts In-Stock

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UNI Independent Distributors

Spain . 7,845 parts In-Stock

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Corphita

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Kepictronics

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Aranea Global

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Perfect Parts

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Overview

Elevate your display driver experience with the MC34845DEPR2 by NXP Semiconductors. As a leading manufacturer in the industry, NXP ensures top-notch quality and reliability in their products. This graphics display driver offers seamless integration with surface mount capability, making it perfect for a range of applications. From enhancing visual displays to optimizing performance, this product delivers value and benefits that customers will appreciate. Upgrade your technology with the MC34845DEPR2 and experience the difference in quality and efficiency.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy installation and replacement, making this product convenient for assembly processes.

Maximum Supply Voltage: 21 V

High maximum supply voltage ensures compatibility with a wide range of power sources, increasing the versatility of the product.

Package Shape: SQUARE

Square package shape provides a compact and uniform design, making it easy to integrate into various display systems.

Power Supplies (V): 12

Stable power supply at 12V ensures consistent performance and reliable operation of the display driver.

No. of Terminals: 24

Having 24 terminals allows for efficient connectivity and communication with external components, ensuring smooth operation of the display system.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style options provide flexibility in design and thermal management, enabling optimal performance in a variety of applications.

Minimum Supply Voltage: 5 V

Low minimum supply voltage requirement allows for energy-efficient operation and potential cost savings on power consumption.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures durability and reliability in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for consistent performance even in extreme cold environments.

Terminal Position: QUAD

Quad terminal position enables efficient soldering and connection, ensuring stable performance and signal integrity.

Maximum Seated Height: 0.65 mm

Low maximum seated height contributes to a slim and compact overall design, suitable for space-constrained applications.

Width: 4 mm

Compact width of 4mm makes the display driver suitable for small form factor devices and applications.

Maximum Time At Peak Reflow Temperature (s): 40

Allows for quick and effective soldering processes, reducing assembly time and improving manufacturing efficiency.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures reliable soldering connections and prevents potential damage during assembly.

Length: 4 mm

Compact length of 4mm complements the width measurement, making the display driver ideal for space-saving designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in rugged conditions and industrial settings.

Terminal Form: NO LEAD

No-lead terminal form complies with environmental regulations and offers safer handling during installation and disposal.

Nominal Supply Voltage: 10 V

Stable nominal supply voltage at 10V ensures consistent and optimal performance of the display driver.

No. of Segments: 96

Having 96 segments allows for detailed and versatile display configurations, enhancing visual capabilities for various applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables precise and reliable connections, ensuring signal integrity and stable operation.

Moisture Sensitivity Level (MSL): 3

MSL level of 3 indicates moderate sensitivity to moisture, requiring appropriate handling precautions during storage and assembly.

Interface IC Type: LED DISPLAY DRIVER

LED display driver interface supports efficient control and management of LED displays, allowing for enhanced visual performance and functionality.

Technical Specifications

Graphics Display Drivers MC34845DEPR2 attributes and parameters. Explore more Graphics Display Drivers devices from NXP Semiconductors

Specs

Interface IC Type:

JESD-30 Code:

S-XQCC-N24

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

96

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

.65 mm

Sub-Category:

Display Drivers

Maximum Supply Voltage:

21 V

Minimum Supply Voltage:

5 V

Nominal Supply Voltage:

10 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4 mm

Trade Compliance

MC34845DEPR2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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