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LH7A404N0F092B3;55

NXP Semiconductors

LH7A404N0F092B3;55 by NXP Semiconductors

NXP Semiconductors' LH7A404N0F092B3;55 is a 32-bit microcontroller with 28-bit address bus width, operating at up to 266 MHz. Ideal for industrial applications, it features flash ROM programmability, 64 I/O lines, and supports DMA channels for efficient data transfer.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,274 parts In-Stock

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Digiode

USA . 3,208 parts In-Stock

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Nova Conductors

Japan . 700 parts In-Stock

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Anansix

USA . 145 parts In-Stock

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Microchip USA

USA . 421 parts In-Stock

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$1.000

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AZTECH Wire

Italy . 390 parts In-Stock

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$6.950

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One Stop Electronics

USA . 807 parts In-Stock

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Ampacity Inc.

Singapore . 1,300 parts In-Stock

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$12.000

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Aztec Data Supply Inc.

USA . 2,286 parts In-Stock

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$56.670

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Corohmni

South Africa . 43 parts In-Stock

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Continental Prestige Electronics

USA . 5,017 parts In-Stock

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UNI Independent Distributors

Spain . 4,348 parts In-Stock

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Corphita

USA . 4,097 parts In-Stock

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Advanced Electronics

New Zealand . 1,711 parts In-Stock

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Argo Parts USA

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Enhance your electronic devices with the LH7A404N0F092B3;55 microcontroller by NXP Semiconductors. This cutting-edge technology offers a seamless integration for various applications, delivering reliable performance and versatility. With a low-profile package style and high-speed clock frequency, this microcontroller ensures optimal functionality while maintaining a compact design. Trust NXP Semiconductors to provide top-of-the-line components that exceed industry standards, giving you the edge in innovation and efficiency. Elevate your projects with the LH7A404N0F092B3;55 microcontroller today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and cost-effectiveness to the product.

Surface Mount: YES

Allows for easier and more efficient assembly onto circuit boards.

Maximum Supply Voltage: 1.89 V

Ensures safe and stable operation within specified limits.

Address Bus Width: 28

Provides sufficient memory addressing capability for complex systems.

Package Shape: SQUARE

Enables efficient use of space on PCBs and facilitates uniform heat dissipation.

Bit Size: 32

Offers high processing power and speed for various applications.

Power Supplies (V): 1.8,3.3

Versatile voltage support for different circuit components and compatibility.

No. of Terminals: 324

Provides ample connectivity options for peripherals and external devices.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Offers a compact design with high terminal density for space-constrained applications.

Minimum Supply Voltage: 1.71 V

Allows for operation at lower power consumption levels for efficiency.

Maximum Operating Temperature: 85 °C

Ensures reliable performance under varying environmental conditions.

Minimum Operating Temperature: -40 °C

Can operate in extreme temperature settings without compromising functionality.

DMA Channels: YES

Enables efficient data transfer and processing for improved system performance.

Terminal Position: BOTTOM

Facilitates easy and secure soldering connections on PCBs.

Maximum Seated Height: 1.7 mm

Low profile design for slim and compact product configurations.

Width: 17 mm

Compact form factor for space-saving and flexible mounting options.

External Data Bus Width: 32

Provides high-speed data transfer capabilities for enhanced processing.

Maximum Clock Frequency: 266 MHz

Supports rapid data processing and real-time operations in various applications.

Length: 17 mm

Balanced dimensions for efficient PCB layout and system integration.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with robust performance and reliability.

Peripheral IC Type: MICROCONTROLLER, RISC

Specific IC type for efficient and optimized processing tasks.

Technology: CMOS

Utilizes low power and high-speed CMOS technology for optimal performance.

Terminal Form: BALL

Ball terminal design for secure and reliable connections during operation.

Nominal Supply Voltage: 1.8 V

Standard voltage support for stable functionality and compatibility.

PWM Channels: YES

Allows for precise control of connected devices for various applications.

ROM Programmability: FLASH

Flash ROM technology enables easy reprogramming and flexibility for updates.

Terminal Pitch: 0.8 mm

Fine pitch terminals for increased connectivity density on PCBs.

Moisture Sensitivity Level (MSL): 3

MSL 3 ensures safe handling and storage of the product during assembly.

Speed: 133 rpm

Suitable speed for various applications requiring precise control and operation.

No. of I/O Lines: 64

Sufficient I/O lines for connectivity and interfacing with external devices.

Technical Specifications

Microcontrollers LH7A404N0F092B3;55 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

NO

Address Bus Width:

28

Bit Size:

32

Maximum Clock Frequency:

266 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B324

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

64

No. of Terminals:

324

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,20X20,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

133 rpm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Trade Compliance

LH7A404N0F092B3;55 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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