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LH7A404N0F000B3;55

NXP Semiconductors

LH7A404N0F000B3;55 by NXP Semiconductors

NXP Semiconductors' LH7A404N0F000B3;55 is a 32-bit microcontroller with 28-bit address bus, operating at up to 200 MHz. Ideal for industrial applications, it features 64 I/O lines, flash ROM programmability, and supports DMA channels for efficient data transfer.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Vyrian

USA . 13,332 parts In-Stock

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Anansix

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Digiode

USA . 1,908 parts In-Stock

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Bristol Electronics

USA . 500 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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50

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AZTECH Wire

Italy . 793 parts In-Stock

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$10.131

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One Stop Electronics

USA . 297 parts In-Stock

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Semicontronic

India . 1,240 parts In-Stock

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$23.280

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Aztec Data Supply Inc.

USA . 1,450 parts In-Stock

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Ampacity Inc.

Singapore . 131 parts In-Stock

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Microchip USA

USA . 482 parts In-Stock

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Corohmni

South Africa . 532 parts In-Stock

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UNI Independent Distributors

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Continental Prestige Electronics

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Argo Parts USA

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Perfect Parts

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Aranea Global

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Corphita

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Assy Fe

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Overview

Unleash the power of innovation with the LH7A404N0F000B3;55 microcontroller from NXP Semiconductors. This cutting-edge device offers unparalleled quality and reliability, perfect for a wide range of applications. From smart home devices to automotive systems, this microcontroller provides exceptional performance and efficiency. Experience seamless operation and advanced functionalities with this product, designed to bring value and benefits to your projects. Upgrade to the LH7A404N0F000B3;55 and elevate your creations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for a wide range of applications.

Surface Mount: YES

Easy to integrate into circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 1.89 V

Allows for efficient power usage and compatibility with low voltage systems.

Address Bus Width: 28

Provides ample address space for memory access and data transfer.

Package Shape: SQUARE

Compact design that fits well in modern electronic devices.

Bit Size: 32

Enables processing of data in 32-bit chunks, improving efficiency and performance.

Power Supplies (V): 1.8,3.3

Offers flexibility in power options for different operating conditions.

No. of Terminals: 324

Plenty of terminals for interfacing with external components and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Advanced packaging technology for improved reliability and signal integrity.

Minimum Supply Voltage: 1.71 V

Allows for operation in low voltage conditions, enhancing energy efficiency.

Maximum Operating Temperature: 85 °C

Can withstand high temperature environments for reliable performance.

Minimum Operating Temperature: -40 °C

Designed to operate in extreme cold conditions without performance degradation.

DMA Channels: YES

Supports Direct Memory Access for efficient data transfer and processing.

Terminal Position: BOTTOM

Convenient terminal placement for soldering and connection to PCBs.

Maximum Seated Height: 1.7 mm

Low profile design for slim and compact devices.

Width: 17 mm

Compact width for easy integration into electronic systems.

External Data Bus Width: 32

Wide data bus for faster data transfer and processing capabilities.

Maximum Clock Frequency: 200 MHz

High clock frequency for rapid data processing and responsiveness.

Length: 17 mm

Compact length for space-constrained applications.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient and optimized processing of instructions.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal design for reliable connections and solder joints.

Nominal Supply Voltage: 1.8 V

Stable supply voltage for consistent and reliable operation.

PWM Channels: YES

Supports Pulse Width Modulation for precise control of analog signals.

ROM Programmability: FLASH

Flash memory for programmability and flexibility in storing instructions and data.

Terminal Pitch: 0.8 mm

Fine pitch for high-density mounting and space-saving on PCBs.

Moisture Sensitivity Level (MSL): 3

Moderate sensitivity to moisture, suitable for a wide range of environments.

Speed: 100 rpm

Capable of processing data at high speeds for demanding applications.

No. of I/O Lines: 64

Sufficient I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LH7A404N0F000B3;55 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

NO

Address Bus Width:

28

Bit Size:

32

Maximum Clock Frequency:

200 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B324

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

64

No. of Terminals:

324

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,20X20,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

100 rpm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Trade Compliance

LH7A404N0F000B3;55 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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