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LD6806TD/18H,125

NXP Semiconductors

LD6806TD/18H,125 by NXP Semiconductors

LD6806TD/18H,125 from NXP Semiconductors is a CMOS voltage regulator with a fixed output of 1.8 V and a max current of 0.2 A. It operates b/w -40 °C to 125 °C, ensuring reliability in various applications. Its small outline package and low dropout voltage make it ideal for compact electronic designs.

Median Price

$0.223

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 12,159 parts In-Stock

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$0.232

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$0.192

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$0.172

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Verical

USA . 12,159 parts In-Stock

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$0.214

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Digiode

USA . 107 parts In-Stock

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$0.093

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Component Electronics Inc.

Canada . 10 parts In-Stock

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$0.960

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$0.720

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$0.630

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Vyrian

USA . 6,010 parts In-Stock

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Anansix

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Prism Electronics

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Corphita

USA . 2,150 parts In-Stock

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$0.088

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Vigor

Singapore . 12,159 parts In-Stock

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$0.090

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Microchip USA

USA . 425 parts In-Stock

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$0.555

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AZTECH Wire

Italy . 803 parts In-Stock

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$18.710

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Continental Prestige Electronics

USA . 12,159 parts In-Stock

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UNI Independent Distributors

Spain . 947 parts In-Stock

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Perfect Parts

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Overview

Discover the LD6806TD/18H,125 from NXP Semiconductors—a top-tier regulator that combines exceptional performance with unmatched reliability. Designed for diverse applications across electronics, this compact and robust solution operates seamlessly in extreme temperatures, ensuring stability where you need it most. With NXP's industry-leading expertise, experience enhanced efficiency and power management that elevates your projects to new heights. Choose quality, choose NXP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliable performance and protection against environmental factors.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into various applications.

Operating Temperature (TJ-Max): 125 °C

A maximum operating temperature of 125 °C indicates robustness and suitability for high-temperature environments.

Technology: CMOS

CMOS technology provides low power consumption and high-speed operation, making it efficient for various applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on circuit boards for efficient design.

Terminal Form: GULL WING

Gull wing terminals ensure strong mechanical strength and reliable solder joints for surface-mounted applications.

Operating Temperature (TJ-Min): -40 °C

A minimum operating temperature of -40 °C allows the product to perform in extreme cold environments.

Maximum Voltage Tolerance: 3 %

A low maximum voltage tolerance offers improved performance reliability under varying input conditions.

Nominal Output Voltage-1: 1.8 V

The stable 1.8V output is ideal for powering modern low-voltage electronics.

No. of Terminals: 5

Five terminals provide sufficient connection options for versatile applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

The thin profile enhances the product's adaptability for compact design and space-saving requirements.

Adjustability: FIXED

A fixed adjustability adds simplicity to design, reducing the need for complex setup or calibration.

Terminal Pitch: 0.95 mm

The 0.95 mm terminal pitch allows for high-density designs, maximizing space efficiency on PCBs.

Maximum Line Regulation: 0.0063 %

Excellent line regulation guarantees minimal output voltage variation with changes in the input voltage, ensuring stable performance.

Terminal Position: DUAL

Dual terminal positioning facilitates better routing and enhances placement flexibility on PCBs.

Maximum Load Regulation: 0.07164 %

Minimal load regulation indicates stable performance under varying load conditions, enhancing reliability in application.

Maximum Output Current-1: 0.2 A

A maximum output current of 0.2 A supports power-hungry devices, making it suitable for diverse applications.

Nominal Dropout Voltage-1: 0.08 V

A low dropout voltage increases efficiency and maximizes battery life in portable applications.

Maximum Input Voltage Absolute: 6 V

The 6V maximum input voltage allows for compatibility across a wide range of power supplies.

Technical Specifications

Other Function Regulators LD6806TD/18H,125 attributes and parameters. Explore more Other Function Regulators devices from NXP Semiconductors

Specs

Adjustability:

FIXED

Nominal Dropout Voltage-1:

.08 V

Maximum Input Voltage Absolute:

6 V

JESD-30 Code:

R-PDSO-G5

Maximum Line Regulation:

.0063 %

Maximum Load Regulation:

.07164 %

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.2 A

Nominal Output Voltage-1:

1.8 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Qualification Status:

Not Qualified

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Voltage Tolerance:

3 %

Trade Compliance

LD6806TD/18H,125 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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