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SN0211070DBVR

Texas Instruments

SN0211070DBVR by Texas Instruments

Texas Instruments' SN0211070DBVR is a CMOS regulator with 5 terminals, adjustable output voltage from 1.6V to 9.5V, and max output current of 0.15A. Ideal for applications requiring precise voltage regulation in temperature range -40°C to 125°C, such as portable electronics and automotive systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,580 parts In-Stock

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9,580

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Digiode

USA . 2,302 parts In-Stock

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2,302

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Distributors (Availability)

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Parana Technologies

USA . 2,340 parts In-Stock

1+ parts

$2.682

100+ parts

-

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$3.165

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2,340

$2.682

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$3.165

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DigiPath Technology Company

USA . 791 parts In-Stock

1+ parts

$2.954

100+ parts

$2.717

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791

$2.954

$2.717

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ChromeModa Solutions

Germany . 1,912 parts In-Stock

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$3.014

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$2.471

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$3.014

$2.471

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IDEA Electronic Components Group

UK . 1,833 parts In-Stock

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$3.014

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$2.713

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1,833

$3.014

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$2.713

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Semicontronic

India . 343 parts In-Stock

1+ parts

$8.500

100+ parts

$8.288

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$8.245

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343

$8.500

$8.288

$8.245

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One Stop Electronics

USA . 575 parts In-Stock

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$9.500

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575

$9.500

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AZTECH Wire

Italy . 677 parts In-Stock

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$13.000

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Ampacity Inc.

Singapore . 1,569 parts In-Stock

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$15.500

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$15.500

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Corphita

USA . 1,455 parts In-Stock

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1,455

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Corohmni

South Africa . 451 parts In-Stock

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Overview

Discover the SN0211070DBVR by Texas Instruments, a high-quality Other Function Regulator designed with precision and reliability in mind. With Texas Instruments' reputation for excellence in manufacturing, this regulator offers unparalleled performance and efficiency. Ideal for a wide range of applications, this compact and versatile regulator provides customers with the value and benefits they need, from adjustable output voltage to superior line regulation. Trust Texas Instruments to deliver cutting-edge technology that meets your power regulation needs with ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where weight and durability are important factors.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving space and making the product suitable for compact designs.

Technology: CMOS

The CMOS technology ensures low power consumption and high efficiency, making the product energy-efficient and suitable for battery-powered devices.

Package Shape: RECTANGULAR

The rectangular package shape provides easy integration into electronic systems and circuit layouts, allowing for efficient use of space.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and secure connections, ensuring reliable performance and ease of installation.

Packing Method: TR

The TR packing method ensures protection during transportation and storage, reducing the risk of damage and ensuring the product reaches the customer in optimal condition.

Minimum Output Voltage: 1.6 V

The minimum output voltage of 1.6 V provides a wide range of output options, making the product versatile and suitable for various applications.

No. of Terminals: 5

The 5 terminals offer flexibility in connection options, allowing for easy integration into different circuit configurations and enhancing compatibility.

Maximum Line Regulation (%/V): 0.1

The low maximum line regulation ensures stable and consistent output voltage, making the product reliable and suitable for precision applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

The small outline and thin profile package style saves space and allows for compact designs, making the product ideal for applications with tight installation requirements.

Adjustability: ADJUSTABLE

The adjustable feature allows for precise voltage control, making the product versatile and suitable for applications where custom voltage settings are required.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable performance in extreme conditions, making the product suitable for industrial and automotive applications.

Terminal Pitch: 0.95 mm

The small terminal pitch of 0.95 mm provides high density and allows for compact design layouts, making the product suitable for applications where space is limited.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable operation in cold environments, making the product suitable for outdoor and harsh climate applications.

Terminal Position: DUAL

The dual terminal position offers redundancy and reliability in connection, ensuring stable performance and making the product suitable for critical applications.

Maximum Output Voltage: 9.5 V

The maximum output voltage of 9.5 V provides a wide range of output options, making the product versatile and suitable for various voltage requirements.

Maximum Output Current: 0.15 A

The maximum output current of 0.15 A allows for powering a range of devices, making the product versatile and suitable for various applications that require different power levels.

Technical Specifications

Other Function Regulators SN0211070DBVR attributes and parameters. Explore more Other Function Regulators devices from Texas Instruments

Specs

Adjustability:

ADJUSTABLE

JESD-30 Code:

R-PDSO-G5

Maximum Line Regulation (%/V):

.1

No. of Outputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Voltage-1:

9.5 V

Minimum Output Voltage-1:

1.6 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Packing Method:

TR

Qualification Status:

Not Qualified

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Trade Compliance

SN0211070DBVR Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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