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IRF530N,127

NXP Semiconductors

IRF530N,127 by NXP Semiconductors

NXP Semiconductors' IRF530N,127 is a N-CHANNEL Power FET with 100V DS Breakdown Voltage. Ideal for SWITCHING applications, it features 68A IDM and 150mJ EAS. With 0.11 ohm RDS(on) and 175°C max temp, this transistor offers high performance in various power circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 6,602 parts In-Stock

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Digiode

USA . 2,573 parts In-Stock

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Anansix

USA . 2,532 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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AZTECH Wire

Italy . 613 parts In-Stock

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$19.476

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Semicontronic

India . 1,520 parts In-Stock

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$26.050

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$25.399

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$25.268

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Ampacity Inc.

Singapore . 261 parts In-Stock

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$51.050

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One Stop Electronics

USA . 1,619 parts In-Stock

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UNI Independent Distributors

Spain . 8,327 parts In-Stock

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Continental Prestige Electronics

USA . 6,906 parts In-Stock

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Argo Parts USA

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Microchip USA

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Corphita

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Overview

Discover the power of the IRF530N,127 by NXP Semiconductors, a high-quality Power Field Effect Transistor designed for switching applications. With a maximum pulsing drain current of 68A and a minimum DS breakdown voltage of 100V, this single-channel transistor offers reliable performance and efficiency. Whether you're creating innovative electronic projects or upgrading existing systems, the IRF530N,127 provides the value, benefits, and advantages you need to succeed. Trust NXP Semiconductors for cutting-edge technology and superior components that deliver exceptional results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the transistor easy to handle and resistant to damage during operation.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have lower on-state resistance and better performance characteristics compared to P-Channel FETs, making this a good choice for efficiency.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and protects the transistor from voltage spikes, enhancing overall reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor can handle rapid changes in current flow efficiently.

Minimum DS Breakdown Voltage: 100 V

With a high breakdown voltage, this transistor can withstand higher voltages, making it suitable for a wide range of applications.

Maximum Pulsed Drain Current (IDM): 68 A

The high pulsed drain current rating allows for reliable operation in high-demand situations without the risk of overheating or damage.

Maximum Power Dissipation (Abs): 63 W

With a high power dissipation rating, this transistor is capable of handling significant power loads without exceeding its limits.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature ensures stable performance even in elevated temperature environments, increasing the versatility of this transistor.

Technical Specifications

Power Field Effect Transistors (FET) IRF530N,127 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Avalanche Energy Rating (EAS):

150 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

15 A

Maximum Drain Current (ID):

17 A

Maximum Drain-Source On Resistance:

.11 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

68 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IRF530N,127 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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