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IP4309CX9

NXP Semiconductors

IP4309CX9 by NXP Semiconductors

IP4309CX9 by NXP Semiconductors is a compact data line filter with 8 functions and 9 terminals, ideal for surface mount applications. It operates b/w -30 °C to 85 °C and features a capacitance of 1.3 µF. Packaged in tape and reel, it's perfect for efficient assembly in electronic devices.

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

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Digiode

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One Stop Electronics

USA . 1,481 parts In-Stock

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AZTECH Wire

Italy . 8,056 parts In-Stock

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A-Z Elektronik GmbH

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Alle Elektronik GmbH

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Perfect Parts

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Supply Digital

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Cyclops Electronics Ltd (Excess)

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Corphita

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Overview

Elevate your designs with the IP4309CX9 from NXP Semiconductors, a trusted leader in innovation and quality. This compact data line filter enhances signal integrity while protecting against noise, making it ideal for consumer electronics, telecommunications, and automotive applications. With its robust temperature range and surface mount capabilities, it ensures reliable performance under diverse conditions. Experience unmatched efficiency and peace of mind with NXP’s commitment to excellence!

Feature Benefit Bullets

Approvals (V): IEC

Meets IEC standards, ensuring reliability and quality for global applications.

No. of Functions: 8

Offers multiple functionalities for versatile usage in various electronic devices.

No. of Terminals: 9

Provides sufficient connection points for easy integration into circuit designs.

Filter Type: DATA LINE FILTER

Specifically designed to reduce noise on data lines, enhancing signal integrity.

Maximum Operating Temperature: 85 °C

High temperature tolerance ensures reliability in demanding environments.

Minimum Operating Temperature: -30 °C

Can operate in low-temperature conditions, making it suitable for diverse applications.

Width: 1.21 mm

Compact size enables integration into space-constrained designs.

Length: 1.21 mm

Minimal length contributes to a small footprint, allowing for efficient circuit layouts.

Packing Method: TAPE AND REEL

Ease of handling and automation in manufacturing processes, improving production efficiency.

Mounting Type: SURFACE MOUNT

Suitable for modern PCB designs, facilitating automated assembly and reducing assembly costs.

Dimensions: L1.21XB1.21XH0.65 (mm) / L0.048XB0.048XH0.026 (inch)

Precise dimensions ensure compatibility with existing design layouts.

Height: 0.65 mm

Low profile design enhances integration options without increasing overall device height.

Capacitance: 1.3 uF

Provides effective filtering and stability for data transmission, ensuring optimal performance.

Technical Specifications

Data Line Filters IP4309CX9 attributes and parameters. Explore more Data Line Filters devices from NXP Semiconductors

Specs

Approvals (V):

IEC

Capacitance:

1.3 uF

Filter Type:

Height:

.65 mm

Length:

1.21 mm

Mounting Type:

SURFACE MOUNT

No. of Functions:

8

No. of Terminals:

9

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Packing Method:

TAPE AND REEL

Dimensions:

L1.21XB1.21XH0.65 (mm)/L0.048XB0.048XH0.026 (inch)

Width (mm):

1.21

Trade Compliance

IP4309CX9 Filters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8504.50.80.00

SB

8504.50.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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