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IP4302CX2/A

NXP Semiconductors

IP4302CX2/A by NXP Semiconductors

The NXP Semiconductors IP4302CX2/A is a single transient suppression device with a bidirectional diode type. It operates b/w -35°C to 85°C, with a min breakdown voltage of 14V. Ideal for applications requiring protection against voltage spikes, it conforms to IEC-60134 and IEC-61000-4-2 standards.

Median Price

$0.057

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 8 parts In-Stock

1+ parts

$0.057

100+ parts

$0.053

1k+ parts

$0.048

10k+ parts

-

8

$0.057

$0.053

$0.048

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Avnet

USA . 8 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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8

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Distributors (In-Stock)

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Digiode

USA . 3,770 parts In-Stock

1+ parts

$0.054

100+ parts

-

1k+ parts

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3,770

$0.054

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Vyrian

USA . 7,237 parts In-Stock

1+ parts

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7,237

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Anansix

USA . 2,076 parts In-Stock

1+ parts

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2,076

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 665 parts In-Stock

1+ parts

$0.051

100+ parts

-

1k+ parts

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10k+ parts

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665

$0.051

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-

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AZTECH Wire

Italy . 10,048 parts In-Stock

1+ parts

$0.060

100+ parts

-

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10,048

$0.060

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UNI Independent Distributors

Spain . 7,654 parts In-Stock

1+ parts

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7,654

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Kepictronics

USA . 2,800 parts In-Stock

1+ parts

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2,800

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Supply Digital

USA . 628 parts In-Stock

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628

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Continental Prestige Electronics

USA . 8 parts In-Stock

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$0.065

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8

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$0.065

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Overview

Discover the IP4302CX2/A by NXP Semiconductors, a top-tier transient suppression device designed to safeguard your electronics from voltage spikes and surges. With a reputation for excellence in manufacturing, NXP Semiconductors delivers quality you can trust. This versatile product is ideal for a range of applications, offering unrivaled protection for your valuable equipment. Experience peace of mind knowing that your devices are shielded from potential damage with the IP4302CX2/A.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protects the device from external factors, ensuring a long lifespan.

Surface Mount: YES

Being surface mountable makes installation easier and more convenient in various applications.

Minimum Breakdown Voltage: 14 V

With a minimum breakdown voltage of 14V, this device effectively suppresses voltage spikes and protects sensitive components from damage.

Technology: AVALANCHE

The use of avalanche technology ensures reliable and fast response to voltage surges, providing efficient protection for connected equipment.

Polarity: BIDIRECTIONAL

A bidirectional polarity allows the device to protect against voltage surges in both directions, making it versatile and suitable for different circuit configurations.

Technical Specifications

Transient Suppression Devices IP4302CX2/A attributes and parameters. Explore more Transient Suppression Devices devices from NXP Semiconductors

Specs

Minimum Breakdown Voltage:

14 V

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

R-PBGA-B2

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-35 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

GRID ARRAY

Polarity:

BIDIRECTIONAL

Reference Standard:

IEC-60134; IEC-61000-4-2

Maximum Repetitive Peak Reverse Voltage:

5 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Form:

Terminal Position:

Trade Compliance

IP4302CX2/A Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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