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HTRM800/AED

NXP Semiconductors

HTRM800/AED by NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: OTHER; Nominal Supply Voltage: 15 V; Package Equivalence Code: MODULE(UNSPEC); Qualification: Not Qualified; Maximum Supply Current: .55 mA;

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,804 parts In-Stock

1+ parts

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1k+ parts

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2,804

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Vyrian

USA . 2,345 parts In-Stock

1+ parts

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2,345

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Digiode

USA . 1,104 parts In-Stock

1+ parts

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1,104

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ComSIT Distribution GmbH

Germany . 5 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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5

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ComSIT USA

USA . 5 parts In-Stock

1+ parts

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100+ parts

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,011 parts In-Stock

1+ parts

$833.000

100+ parts

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1,011

$833.000

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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Corphita

USA . 4,397 parts In-Stock

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4,397

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UNI Independent Distributors

Spain . 555 parts In-Stock

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555

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Technical Specifications

Other Function Telecom Interface ICs HTRM800/AED attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

Nominal Negative Supply Voltage:

-15 V

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

MODULE(UNSPEC)

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Power Supplies (V):

+-15

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.55 mA

Nominal Supply Voltage:

15 V

Telecom IC Type:

Temperature Grade:

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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