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HT1ICS3002W/V9F

NXP Semiconductors

HT1ICS3002W/V9F by NXP Semiconductors

HT1ICS3002W/V9F by NXP Semiconductors is a telecom interface IC designed for industrial applications. It operates b/w -40 °C to 85 °C, with a nominal voltage of 3.5V and features a no-lead design in a rectangular package. Ideal for surface mount technology, it enhances communication systems efficiently.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,162 parts In-Stock

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2,162

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Anansix

USA . 2,066 parts In-Stock

1+ parts

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1k+ parts

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2,066

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Digiode

USA . 269 parts In-Stock

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269

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,449 parts In-Stock

1+ parts

$394.000

100+ parts

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1,449

$394.000

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Corphita

USA . 3,623 parts In-Stock

1+ parts

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3,623

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UNI Independent Distributors

Spain . 553 parts In-Stock

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553

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Overview

Elevate your telecom applications with the HT1ICS3002W/V9F from NXP Semiconductors—your trusted partner in innovation. Designed for reliability, this compact interface IC excels in industrial environments, ensuring stable performance from -40 °C to 85 °C. With its efficient design and robust quality, it streamlines integration while offering unmatched value. Choose NXP for unparalleled expertise and experience the seamless connectivity your projects demand!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact integration on PCB, making it suitable for space-constrained applications.

Package Shape: RECTANGULAR

The rectangular package shape is ideal for efficient layout and assembly on circuit boards.

No. of Terminals: 5

With 5 terminals, this IC balances complexity and functionality, fitting well within various circuit designs.

Package Style (Meter): UNCASED CHIP

An uncased chip provides flexibility for custom mounting solutions and enables thermal management optimizations.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures makes this IC reliable for industrial applications, ensuring longevity in challenging environments.

Minimum Operating Temperature: -40 °C

Withstanding low temperatures, this IC is suitable for harsh conditions, enhancing the versatility of its applications.

Terminal Position: UPPER

Upper terminal positioning improves accessibility for soldering and makes the chip easier to integrate into PCB layouts.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature standards, this IC is designed for durability and consistent performance in demanding environments.

Terminal Form: NO LEAD

No lead terminals reduce the risk of environmental lead contamination, aligning with modern eco-friendly design practices.

Telecom IC Type: TELECOM CIRCUIT

As a dedicated telecom IC, it is optimized for communication applications, ensuring reliability in data transmission and signal integrity.

Nominal Supply Voltage: 3.5 V

The 3.5 V supply voltage supports low-power applications, making it energy-efficient while maintaining performance.

Technical Specifications

Other Function Telecom Interface ICs HT1ICS3002W/V9F attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-XUUC-N5

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Nominal Supply Voltage:

3.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

HT1ICS3002W/V9F Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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