Loading...

HEF4517BT,518

NXP Semiconductors

HEF4517BT,518 by NXP Semiconductors

SERIAL IN SERIAL OUT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

$0.810

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 247 parts In-Stock

1+ parts

$0.810

100+ parts

$0.790

1k+ parts

$0.780

10k+ parts

-

247

$0.810

$0.790

$0.780

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,929 parts In-Stock

1+ parts

$0.770

100+ parts

-

1k+ parts

-

10k+ parts

-

1,929

$0.770

-

-

-

Vyrian

USA . 11,684 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,684

-

-

-

-

Anansix

USA . 978 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

978

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,568 parts In-Stock

1+ parts

$0.729

100+ parts

-

1k+ parts

-

10k+ parts

-

3,568

$0.729

-

-

-

Native Components

USA . 433 parts In-Stock

1+ parts

$2.102

100+ parts

-

1k+ parts

-

10k+ parts

-

433

$2.102

-

-

-

Northwest PG Solutions

USA . 848 parts In-Stock

1+ parts

$2.313

100+ parts

-

1k+ parts

-

10k+ parts

-

848

$2.313

-

-

-

AZTECH Wire

Italy . 709 parts In-Stock

1+ parts

$10.020

100+ parts

-

1k+ parts

-

10k+ parts

-

709

$10.020

-

-

-

Microchip USA

USA . 239 parts In-Stock

1+ parts

$10.945

100+ parts

-

1k+ parts

-

10k+ parts

-

239

$10.945

-

-

-

Advanced Electronics

New Zealand . 300 parts In-Stock

1+ parts

$16.873

100+ parts

$15.354

1k+ parts

$13.836

10k+ parts

-

300

$16.873

$15.354

$13.836

-

Component Stockers USA

USA . 434 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

434

$99.990

-

-

-

UNI Independent Distributors

Spain . 6,930 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,930

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 5,053 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,053

-

-

-

-

Perfect Parts

USA . 1,764 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,764

-

-

-

-

Technical Specifications

Digital Shift Registers HEF4517BT,518 attributes and parameters. Explore more Digital Shift Registers devices from NXP Semiconductors

Specs

Additional Features:

OUTPUTS ALSO AVAILABLE AT 16TH, 32ND AND 48TH STAGE OF THE SHIFT REGISTER

Count Direction:

RIGHT

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

2000000 Hz

Moisture Sensitivity Level (MSL):

2

No. of Bits:

64

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay (tpd):

440 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Minimum fmax:

2 MHz

Trade Compliance

HEF4517BT,518 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20