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HEF4071BP,652

NXP Semiconductors

HEF4071BP,652 by NXP Semiconductors

OR GATE; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;

Median Price

$0.370

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 57,915 parts In-Stock

1+ parts

$0.370

100+ parts

$0.360

1k+ parts

$0.360

10k+ parts

-

57,915

$0.370

$0.360

$0.360

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,714 parts In-Stock

1+ parts

$0.352

100+ parts

-

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-

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3,714

$0.352

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-

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Forefront Electronics and Design

USA . 10 parts In-Stock

1+ parts

$12.250

100+ parts

-

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-

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10

$12.250

-

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Vyrian

USA . 3,337 parts In-Stock

1+ parts

-

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3,337

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Anansix

USA . 1,754 parts In-Stock

1+ parts

-

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1,754

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LIBRA Elektronik GmbH

Germany . 454 parts In-Stock

1+ parts

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454

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J2 Sourcing AB

Sweden . 7 parts In-Stock

1+ parts

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7

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 192 parts In-Stock

1+ parts

$0.266

100+ parts

-

1k+ parts

-

10k+ parts

$0.256

192

$0.266

-

-

$0.256

Northwest PG Solutions

USA . 2,245 parts In-Stock

1+ parts

$0.293

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-

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$0.258

2,245

$0.293

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$0.258

Corphita

USA . 75 parts In-Stock

1+ parts

$0.333

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75

$0.333

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Microchip USA

USA . 239 parts In-Stock

1+ parts

$3.227

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239

$3.227

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AZTECH Wire

Italy . 956 parts In-Stock

1+ parts

$16.590

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956

$16.590

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UNI Independent Distributors

Spain . 8,306 parts In-Stock

1+ parts

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8,306

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Perfect Parts

USA . 2,094 parts In-Stock

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2,094

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Technical Specifications

Logic Gates HEF4071BP,652 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e4

Length:

19.025 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

.36 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

115 ns

Propagation Delay (tpd):

115 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

4.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

HEF4071BP,652 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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