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HEF4051BP,652

NXP Semiconductors

HEF4051BP,652 by NXP Semiconductors

SINGLE-ENDED MULTIPLEXER; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;

Median Price

-

Lifecycle Status

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6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,767 parts In-Stock

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Anansix

USA . 1,009 parts In-Stock

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Digiode

USA . 786 parts In-Stock

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EMSNET

USA . 665 parts In-Stock

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Flex Direct, LLC

USA . 38 parts In-Stock

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Bristol Electronics

USA . 5 parts In-Stock

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Distributors (Availability)

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Microchip USA

USA . 222 parts In-Stock

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$0.917

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One Stop Electronics

USA . 622 parts In-Stock

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$1.500

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AZTECH Wire

Italy . 200 parts In-Stock

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$16.900

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Native Components

USA . 785 parts In-Stock

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$294.267

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$291.233

785

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Northwest PG Solutions

USA . 1,813 parts In-Stock

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$333.705

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Perfect Parts

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UNI Independent Distributors

Spain . 1,026 parts In-Stock

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Corphita

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Technical Specifications

Multiplexers & Switches HEF4051BP,652 attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

21.6 mm

Nominal Negative Supply Voltage (Vsup):

0 V

No. of Channels:

8

No. of Functions:

1

No. of Terminals:

16

Nominal Off-state Isolation:

50 dB

Nominal On-state Resistance Match:

5 ohm

Maximum On-state Resistance (Ron):

175 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

4.7 mm

Maximum Signal Current:

.01 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.6 mA

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Maximum Switch-off Time:

230 ns

Maximum Switch-on Time:

80 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

HEF4051BP,652 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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