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FS32K146HFT0MLHR

NXP Semiconductors

FS32K146HFT0MLHR by NXP Semiconductors

NXP Semiconductors' FS32K146HFT0MLHR microcontroller features 32-bit CPU, 40 MHz clock frequency, and 131072 bytes of RAM. Ideal for automotive applications requiring ISO 26262 screening, it offers CAN, I2C, LIN connectivity and low power mode with a wide operating temperature range from -40 to 125°C.

Median Price

$5.846

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 124,500 parts In-Stock

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$5.846

Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

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$17.310

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100

$17.310

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TME

Poland . 115,500 parts In-Stock

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$7.220

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$7.220

Vyrian

USA . 7,589 parts In-Stock

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Digiode

USA . 872 parts In-Stock

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872

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Anansix

USA . 93 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 536 parts In-Stock

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$1.000

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536

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AZTECH Wire

Italy . 549 parts In-Stock

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$9.948

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Vigor

Singapore . 607 parts In-Stock

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$13.420

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Ampacity Inc.

Singapore . 1,340 parts In-Stock

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$15.000

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Netroflash

USA . 1,000 parts In-Stock

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$17.310

100+ parts

$16.964

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$16.444

10k+ parts

$16.098

1,000

$17.310

$16.964

$16.444

$16.098

Microchip USA

USA . 3,400 parts In-Stock

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$46.151

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Corohmni

South Africa . 515 parts In-Stock

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$54.474

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UNI Independent Distributors

Spain . 6,070 parts In-Stock

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Corphita

USA . 2,932 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the FS32K146HFT0MLHR by NXP Semiconductors. As a leading manufacturer of microcontrollers, NXP delivers top-notch quality and reliability. This versatile microcontroller is perfect for a wide range of applications, offering unmatched performance and seamless connectivity. Experience the value and benefits of advanced features such as integrated cache, analog-to-digital converters, and low-power modes. Elevate your projects with the FS32K146HFT0MLHR and unlock endless possibilities in innovation and efficiency.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material ensures durability and reliability in various environments.

Integrated Cache:

YES - Improves processing speed and efficiency of the microcontroller.

Surface Mount:

YES - Allows for easy assembly and integration into electronic devices.

Maximum Supply Voltage:

5.5 V - Provides flexibility in power requirements for different applications.

On Chip Data RAM Width:

8 - Offers ample memory space for data storage and processing.

Screening Level:

ISO 26262 - Ensures high quality and safety standards in automotive applications.

Package Shape:

SQUARE - Facilitates easy placement and soldering on PCBs.

Bit Size:

32 - Enabling complex calculations and operations to be performed efficiently.

No. of Terminals:

64 - Allows for connection to various peripherals and external components.

Package Style:

FLATPACK, LOW PROFILE, FINE PITCH - Offers compact design and high-density mounting options.

Minimum Supply Voltage:

2.7 V - Allows for operation in low power or battery-operated systems.

Maximum Operating Temperature:

125 °C - Suitable for use in high-temperature environments or industrial applications.

CPU Family:

CORTEX-M4F - Provides high performance and energy efficiency for embedded systems.

Minimum Operating Temperature:

40 °C - Ensures reliable operation in extreme cold conditions.

Terminal Finish:

TIN - Ensures good electrical conductivity and solderability.

ADC Channels:

YES - Enables analog signal conversion for sensor interfacing.

DMA Channels:

YES - Enhances data transfer efficiency and reduces CPU workload.

Terminal Position:

QUAD - Facilitates easy PCB layout and soldering.

ROM Words:

1048576 - Offers large storage capacity for program memory.

Maximum Seated Height:

1.6 mm - Suitable for compact and slim device designs.

Digital To Analog Converters:

1-Ch 8-Bit - Provides analog output capability for control and communication.

Width:

10 mm - Compact size for space-constrained applications.

Data EEPROM Size:

4096 - Allows for non-volatile data storage.

Boundary Scan:

YES - Simplifies testing and debugging during development and production.

Technical Specifications

Microcontrollers FS32K146HFT0MLHR attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of I/O Lines:

58

No. of Serial I/Os:

3

No. of Terminals:

64

No. of Timers:

50

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

131072

ROM Words:

1048576

ROM Programmability:

FLASH

Screening Level:

ISO 26262

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

4096

Connectivity:

CAN(3), I2C, LIN(3), LPUART(3), SPI(3)

Peripherals:

BOR, COMPARATOR, POR, RTC, TIMER(50), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 8-Bit

Trade Compliance

FS32K146HFT0MLHR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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