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FS32K144UAT0VLLR

NXP Semiconductors

FS32K144UAT0VLLR by NXP Semiconductors

MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE; ROM Programmability: FLASH;

Median Price

$8.746

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 580 parts In-Stock

1+ parts

$10.230

100+ parts

$6.550

1k+ parts

$5.260

10k+ parts

-

580

$10.230

$6.550

$5.260

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EBV Elektronik

Germany . 1,000 parts In-Stock

1+ parts

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Verical

USA . 1,000 parts In-Stock

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$7.263

10k+ parts

$6.124

1,000

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-

$7.263

$6.124

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,398 parts In-Stock

1+ parts

$12.369

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3,398

$12.369

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Vyrian

USA . 7,767 parts In-Stock

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7,767

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Anansix

USA . 2,854 parts In-Stock

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2,854

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TME

Poland . 1,000 parts In-Stock

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$6.400

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$6.400

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 353 parts In-Stock

1+ parts

$11.718

100+ parts

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353

$11.718

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Vigor

Singapore . 939 parts In-Stock

1+ parts

$11.880

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939

$11.880

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Microchip USA

USA . 3,150 parts In-Stock

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$21.498

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Northwest PG Solutions

USA . 1,030 parts In-Stock

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UNI Independent Distributors

Spain . 669 parts In-Stock

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669

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Native Components

USA . 134 parts In-Stock

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134

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Technical Specifications

Microcontrollers FS32K144UAT0VLLR attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

16

No. of I/O Lines:

89

No. of Serial I/Os:

3

No. of Terminals:

100

No. of Timers:

34

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

65536

ROM Words:

524288

ROM Programmability:

FLASH

Screening Level:

ISO 26262

Maximum Seated Height:

1.7 mm

Speed:

112 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

4096

Connectivity:

CAN(3), I2C, LIN(3), LPUART(3), SPI(3)

Peripherals:

BOR, COMPARATOR, POR, RTC, TIMER(34), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 8-Bit

Trade Compliance

FS32K144UAT0VLLR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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