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FS32K142MRT0CLHR

NXP Semiconductors

FS32K142MRT0CLHR by NXP Semiconductors

NXP Semiconductors' FS32K142MRT0CLHR microcontroller features 32-bit CPU, 50 MHz clock frequency, and 32768 bytes of RAM. Ideal for applications requiring low power mode, with peripherals like PWM, RTC, and UART for connectivity via CAN, I2C, or SPI interfaces.

Median Price

$13.120

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

$13.120

1k+ parts

$11.740

10k+ parts

$11.050

3,000

-

$13.120

$11.740

$11.050

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,500 parts In-Stock

1+ parts

$13.851

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1,500

$13.851

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Vyrian

USA . 5,458 parts In-Stock

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5,458

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Anansix

USA . 403 parts In-Stock

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403

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Vigor

Singapore . 404 parts In-Stock

1+ parts

$7.730

100+ parts

-

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404

$7.730

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AZTECH Wire

Italy . 754 parts In-Stock

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$12.190

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754

$12.190

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Semicontronic

India . 2,973 parts In-Stock

1+ parts

$12.390

100+ parts

$12.080

1k+ parts

$12.018

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-

2,973

$12.390

$12.080

$12.018

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Ampacity Inc.

Singapore . 2,811 parts In-Stock

1+ parts

$12.390

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2,811

$12.390

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Corphita

USA . 1,828 parts In-Stock

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$13.122

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$13.122

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Component Stockers USA

USA . 4,052 parts In-Stock

1+ parts

$16.550

100+ parts

$15.550

1k+ parts

$14.060

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4,052

$16.550

$15.550

$14.060

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Aztec Data Supply Inc.

USA . 4,663 parts In-Stock

1+ parts

$21.350

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4,663

$21.350

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Microchip USA

USA . 2,458 parts In-Stock

1+ parts

$46.150

100+ parts

$45.490

1k+ parts

$45.160

10k+ parts

$44.830

2,458

$46.150

$45.490

$45.160

$44.830

Corohmni

South Africa . 251 parts In-Stock

1+ parts

$49.446

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251

$49.446

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Continental Prestige Electronics

USA . 5,706 parts In-Stock

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Argo Parts USA

USA . 3,793 parts In-Stock

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UNI Independent Distributors

Spain . 2,023 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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Overview

Elevate your next project with the FS32K142MRT0CLHR by NXP Semiconductors, a top-of-the-line microcontroller designed to deliver unmatched performance and reliability. With advanced features like integrated cache, low power mode, and a maximum clock frequency of 50 MHz, this product is perfect for a wide range of applications. NXP Semiconductors, known for its high-quality components, ensures that you're getting a product that will exceed your expectations. Experience seamless connectivity, efficient data processing, and exceptional value with the FS32K142MRT0CLHR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and resistant to mechanical stress, ensuring a longer lifespan.

Integrated Cache: YES

Having an integrated cache improves the overall performance of the microcontroller by reducing access times to frequently used data and instructions.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in power supply options, accommodating various systems and applications.

No. of I/O Lines: 58

A high number of I/O lines offer versatility in connecting external devices and peripherals, making the microcontroller suitable for complex projects.

CPU Family: CORTEX-M4F

The Cortex-M4F architecture ensures high efficiency and performance in processing tasks, making it a reliable choice for demanding applications.

Technical Specifications

Microcontrollers FS32K142MRT0CLHR attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of I/O Lines:

58

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Screening Level:

ISO 26262

Maximum Seated Height:

1.6 mm

Speed:

64 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

4096

Connectivity:

CAN(2), I2C, SPI(2), UART(2)

Peripherals:

ANALOG COMPARATOR, CRC, DMA(16), POR, PWM, RTC, TIMER(8), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

FS32K142MRT0CLHR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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