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FS32K118LAT0VLHT

NXP Semiconductors

FS32K118LAT0VLHT by NXP Semiconductors

NXP Semiconductors' FS32K118LAT0VLHT microcontroller features 32-bit architecture, 40 MHz clock frequency, and Cortex-M0+ CPU family. Ideal for applications requiring low power consumption, such as automotive systems, with ISO 26262 screening level for safety-critical environments. Offers integrated cache, 25600 bytes of RAM, and connectivity options like CAN, I2C, LIN(2), LPUART(2), SPI(2).

Median Price

$6.870

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 800 parts In-Stock

1+ parts

$6.870

100+ parts

$4.250

1k+ parts

$3.670

10k+ parts

-

800

$6.870

$4.250

$3.670

-

Mouser Electronics

USA . 800 parts In-Stock

1+ parts

$6.970

100+ parts

$4.200

1k+ parts

$3.120

10k+ parts

$3.080

800

$6.970

$4.200

$3.120

$3.080

Flip Electronics (Authorized)

USA . 27,100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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27,100

-

-

-

-

Verical

USA . 800 parts In-Stock

1+ parts

-

100+ parts

$4.250

1k+ parts

$3.829

10k+ parts

-

800

-

$4.250

$3.829

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 85 parts In-Stock

1+ parts

$5.505

100+ parts

-

1k+ parts

-

10k+ parts

-

85

$5.505

-

-

-

Maritex

Poland . 769 parts In-Stock

1+ parts

$6.708

100+ parts

$3.979

1k+ parts

$3.248

10k+ parts

-

769

$6.708

$3.979

$3.248

-

Digiode

USA . 1,526 parts In-Stock

1+ parts

$7.087

100+ parts

-

1k+ parts

-

10k+ parts

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1,526

$7.087

-

-

-

Flip Electronics

USA . 27,100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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27,100

-

-

-

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Vyrian

USA . 4,530 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,530

-

-

-

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Anansix

USA . 1,283 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,283

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bastille Electronics

Australia . 450 parts In-Stock

1+ parts

$5.505

100+ parts

$5.230

1k+ parts

$4.968

10k+ parts

$4.899

450

$5.505

$5.230

$4.968

$4.899

Corphita

USA . 2,238 parts In-Stock

1+ parts

$6.714

100+ parts

-

1k+ parts

-

10k+ parts

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2,238

$6.714

-

-

-

Vigor

Singapore . 726 parts In-Stock

1+ parts

$7.320

100+ parts

-

1k+ parts

-

10k+ parts

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726

$7.320

-

-

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Ampacity Inc.

Singapore . 7,091 parts In-Stock

1+ parts

$12.690

100+ parts

-

1k+ parts

-

10k+ parts

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7,091

$12.690

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-

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Microchip USA

USA . 2,661 parts In-Stock

1+ parts

$17.477

100+ parts

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1k+ parts

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10k+ parts

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2,661

$17.477

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GreenTree Electronics

Israel . 6,400 parts In-Stock

1+ parts

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100+ parts

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6,400

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-

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Lixinc

USA . 3,002 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,002

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-

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Perfect Parts

USA . 2,688 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,688

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-

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,000

-

-

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UNI Independent Distributors

Spain . 809 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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809

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Overview

Unlock the power of innovation with the FS32K118LAT0VLHT by NXP Semiconductors, a cutting-edge microcontroller that offers unparalleled quality and performance. Designed for a wide range of applications, this device boasts integrated cache, advanced connectivity options, and low power mode for optimal efficiency. With NXP Semiconductors' reputation for reliability and precision, customers can trust in the value and benefits this product provides. Experience seamless operation, robust functionality, and limitless possibilities with the FS32K118LAT0VLHT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material helps to keep the package lightweight and durable, making the product suitable for various applications.

Integrated Cache: YES

The integrated cache improves the overall performance and efficiency of the microcontroller by reducing memory access times.

Maximum Supply Voltage: 5.5 V

Higher maximum supply voltage allows for compatibility with a wide range of power sources and applications.

On Chip Data RAM Width: 8

Having a wider data RAM width allows for faster processing of data, enhancing the overall performance of the microcontroller.

Screening Level: ISO 26262

Compliance with ISO 26262 ensures the product's reliability and safety for automotive applications where functional safety is crucial.

Package Shape: SQUARE

The square package shape provides stability and easy mounting, making it suitable for compact designs and space-constrained applications.

Bit Size: 32

A larger bit size enables the microcontroller to handle more complex calculations and data manipulation, making it ideal for advanced applications.

No. of Terminals: 64

Having a higher number of terminals allows for more connectivity options and I/O interfaces, expanding the microcontroller's versatility.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, the microcontroller can withstand harsh environmental conditions, ensuring reliable performance in various applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range makes the microcontroller suitable for use in both extreme cold and hot environments without compromising performance.

Technical Specifications

Microcontrollers FS32K118LAT0VLHT attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

Cortex-M0+

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of I/O Lines:

58

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

25600

ROM Words:

262144

ROM Programmability:

FLASH

Screening Level:

ISO 26262

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

2048

Connectivity:

CAN, I2C, LIN(2), LPUART(2), SPI(2)

Peripherals:

BOR, COMPARATOR, POR, RTC, TIMER(18), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 8-Bit

Trade Compliance

FS32K118LAT0VLHT Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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