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DSPA56371AF180

NXP Semiconductors

DSPA56371AF180 by NXP Semiconductors

Digital Signal Processors; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: QFP; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

DSPA56371AF180 by NXP Semiconductors
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Flip Electronics (Authorized)

USA . 2,430 parts In-Stock

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Vyrian

USA . 4,231 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,790 parts In-Stock

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ComSIT USA

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Digiode

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Anansix

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Ampacity Inc.

Singapore . 2,223 parts In-Stock

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Corohmni

South Africa . 5,157 parts In-Stock

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One Stop Electronics

USA . 2,088 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 17,229 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,733 parts In-Stock

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Microchip USA

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Alle Elektronik GmbH

Germany . 3,822 parts In-Stock

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Corphita

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Northwest PG Solutions

USA . 1,676 parts In-Stock

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Metaverse IC Inc.

Canada . 1,258 parts In-Stock

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Native Components

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Technical Specifications

Digital Signal Processors (DSPs) DSPA56371AF180 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from NXP Semiconductors

Specs

Bit Size:

24

Format:

FIXED POINT

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

80

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.25,3.3

Qualification:

Not Qualified

RAM Words:

86016

Sub-Category:

Digital Signal Processors

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

DSPA56371AF180 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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