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CGD982HCI

NXP Semiconductors

CGD982HCI by NXP Semiconductors

CGD982HCI by NXP Semiconductors is a hybrid consumer circuit IC featuring a rectangular flange mount package with 7 terminals. It boasts gold terminal finish and through-hole form, making it ideal for various consumer applications. This versatile component enhances device performance and reliability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,543 parts In-Stock

1+ parts

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1,543

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Vyrian

USA . 703 parts In-Stock

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703

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Anansix

USA . 455 parts In-Stock

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455

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Distributors (Availability)

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Native Components

USA . 695 parts In-Stock

1+ parts

$7.402

100+ parts

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695

$7.402

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One Stop Electronics

USA . 1,492 parts In-Stock

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$7.800

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1,492

$7.800

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UNI Independent Distributors

Spain . 6,063 parts In-Stock

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6,063

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Corphita

USA . 2,437 parts In-Stock

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2,437

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Northwest PG Solutions

USA . 2,270 parts In-Stock

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$7.254

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2,270

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$7.254

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Kepictronics

USA . 550 parts In-Stock

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550

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Perfect Parts

USA . 125 parts In-Stock

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125

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Overview

Elevate your consumer electronics with the CGD982HCI by NXP Semiconductors, a trusted leader in innovative solutions. Designed for superior performance, this versatile IC enhances reliability and efficiency across various applications, from home automation to smart devices. Enjoy the peace of mind that comes with NXP's commitment to quality and customer satisfaction, unlocking new possibilities while maximizing your project’s value!

Feature Benefit Bullets

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of PCB space and facilitates better integration into various electronic designs.

General IC Type: CONSUMER CIRCUIT

Being a consumer circuit IC, it is designed specifically for reliability and performance in everyday consumer electronics, making it ideal for a wide range of applications.

No. of Terminals: 7

With seven terminals, this IC can support multiple functionalities and connections, providing flexibility in design and implementation.

Package Style (Meter): FLANGE MOUNT

The flange mount style enhances mechanical stability and allows for easier mounting on PCBs, ensuring a robust connection.

Terminal Finish: GOLD

Gold terminal finish ensures excellent conductivity and corrosion resistance, resulting in improved performance and longevity of the product.

Terminal Position: SINGLE

A single terminal position simplifies the design and layout processes, making it easier to integrate into various configurations.

Technology: HYBRID

The hybrid technology combines the advantages of different materials and processes, resulting in enhanced performance characteristics and versatility.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides strong physical connections, making it suitable for applications that demand durability and resistance to mechanical stress.

Technical Specifications

Other Function Consumer ICs CGD982HCI attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-XSFM-T7

JESD-609 Code:

e4

No. of Functions:

1

No. of Terminals:

7

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Surface Mount:

NO

Technology:

HYBRID

Terminal Finish:

GOLD

Terminal Form:

Terminal Position:

SINGLE

Trade Compliance

CGD982HCI General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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