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CBTU4411EE,557

NXP Semiconductors

CBTU4411EE,557 by NXP Semiconductors

BUS TRANSCEIVER; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 72; Package Code: LFBGA; Package Shape: SQUARE;

Median Price

$1.348

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,080 parts In-Stock

1+ parts

-

100+ parts

$1.320

1k+ parts

$1.100

10k+ parts

$0.977

1,080

-

$1.320

$1.100

$0.977

Verical

USA . 1,080 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.375

10k+ parts

$1.221

1,080

-

-

$1.375

$1.221

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,378 parts In-Stock

1+ parts

$1.026

100+ parts

-

1k+ parts

-

10k+ parts

-

4,378

$1.026

-

-

-

Vyrian

USA . 9,337 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,337

-

-

-

-

Anansix

USA . 1,766 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,766

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 607 parts In-Stock

1+ parts

$0.972

100+ parts

-

1k+ parts

-

10k+ parts

-

607

$0.972

-

-

-

Microchip USA

USA . 490 parts In-Stock

1+ parts

$8.205

100+ parts

-

1k+ parts

-

10k+ parts

-

490

$8.205

-

-

-

AZTECH Wire

Italy . 629 parts In-Stock

1+ parts

$12.940

100+ parts

-

1k+ parts

-

10k+ parts

-

629

$12.940

-

-

-

Andel Nordic

Denmark . 3,639 parts In-Stock

1+ parts

$29.020

100+ parts

-

1k+ parts

$20.314

10k+ parts

$20.314

3,639

$29.020

-

$20.314

$20.314

QUARKTWIN TECHNOLOGY LTD

USA . 10,084 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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10,084

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Native Components

USA . 949 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.308

10k+ parts

-

949

-

-

$3.308

-

UNI Independent Distributors

Spain . 740 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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740

-

-

-

-

Northwest PG Solutions

USA . 195 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$3.342

10k+ parts

-

195

-

-

$3.342

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Technical Specifications

Bus Driver & Transceivers CBTU4411EE,557 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

S-PBGA-B72

JESD-609 Code:

e1

Length:

7 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Bits:

11

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

72

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA72,11X11,20

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Propagation Delay (tpd):

.1 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

CBTU4411EE,557 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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