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CBT3125D,118

NXP Semiconductors

CBT3125D,118 by NXP Semiconductors

BUS DRIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

$0.298

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 43,800 parts In-Stock

1+ parts

-

100+ parts

$0.298

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$0.247

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$0.220

43,800

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$0.298

$0.247

$0.220

Verical

USA . 40,000 parts In-Stock

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$0.275

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$0.275

DigiKey

USA . 4,865 parts In-Stock

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$0.370

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4,865

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Distributors (In-Stock)

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Digiode

USA . 1,234 parts In-Stock

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$0.119

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Chip Stock

USA . 145,000 parts In-Stock

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DigiKey Marketplace

USA . 4,865 parts In-Stock

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$0.130

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Vyrian

USA . 3,692 parts In-Stock

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Anansix

USA . 2,113 parts In-Stock

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Bristol Electronics

USA . 1,880 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,586 parts In-Stock

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$0.112

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AZTECH Wire

Italy . 12,778 parts In-Stock

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$0.130

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Microchip USA

USA . 1,799 parts In-Stock

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$0.845

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Continental Prestige Electronics

USA . 43,800 parts In-Stock

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$0.150

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QUARKTWIN TECHNOLOGY LTD

USA . 17,344 parts In-Stock

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UNI Independent Distributors

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Andel Nordic

Denmark . 2,482 parts In-Stock

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Northwest PG Solutions

USA . 1,206 parts In-Stock

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Native Components

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Supply Digital

USA . 974 parts In-Stock

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iodParts Technologies Inc.

India . 57 parts In-Stock

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Technical Specifications

Bus Driver & Transceivers CBT3125D,118 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CBT3125D,118 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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