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BZA456A,135

NXP Semiconductors

BZA456A,135 by NXP Semiconductors

BZA456A,135 by NXP Semiconductors is a transient suppression device with common anode configuration and 4 elements. It has a max non-repetitive peak reverse power dissipation of 24W and max clamping voltage of 8V. Ideal for applications requiring protection against voltage transients in electronic circuits.

Median Price

$0.249

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 10,000 parts In-Stock

1+ parts

$0.081

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-

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$0.081

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Arrow

USA . 10,000 parts In-Stock

1+ parts

$0.430

100+ parts

$0.168

1k+ parts

$0.088

10k+ parts

$0.086

10,000

$0.430

$0.168

$0.088

$0.086

Mouser Electronics

USA . 820 parts In-Stock

1+ parts

$0.660

100+ parts

$0.286

1k+ parts

$0.158

10k+ parts

$0.105

820

$0.660

$0.286

$0.158

$0.105

Future Electronics

Canada . 60,000 parts In-Stock

1+ parts

-

100+ parts

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$0.330

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$0.330

Verical

USA . 10,000 parts In-Stock

1+ parts

-

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$0.168

1k+ parts

$0.088

10k+ parts

$0.086

10,000

-

$0.168

$0.088

$0.086

DigiKey

USA . 5,140 parts In-Stock

1+ parts

-

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$0.086

5,140

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$0.086

Distributors (In-Stock)

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Digiode

USA . 161 parts In-Stock

1+ parts

$0.294

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161

$0.294

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Chip Stock

USA . 100,000 parts In-Stock

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NAC Semi

USA . 50,000 parts In-Stock

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$0.660

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$0.660

IBS Electronics

USA . 30,000 parts In-Stock

1+ parts

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$0.465

30,000

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$0.465

Vyrian

USA . 2,600 parts In-Stock

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2,600

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Anansix

USA . 1,555 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 10,468 parts In-Stock

1+ parts

$0.070

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$0.070

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Corphita

USA . 4,826 parts In-Stock

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$0.279

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4,826

$0.279

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Native Components

USA . 403 parts In-Stock

1+ parts

$189.487

100+ parts

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$181.908

403

$189.487

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$181.908

Northwest PG Solutions

USA . 299 parts In-Stock

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$208.436

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299

$208.436

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UNI Independent Distributors

Spain . 5,140 parts In-Stock

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Futuretech Components

Singapore . 5,000 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Supply Digital

USA . 984 parts In-Stock

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984

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Overview

Experience superior transient suppression with BZA456A,135 by NXP Semiconductors. As a leader in semiconductor technology, NXP delivers top-quality products that guarantee reliability and performance. This common anode device, featuring 4 elements in a small outline package, provides exceptional protection against voltage spikes, making it ideal for a wide range of applications. Trust in NXP's expertise to safeguard your electronics and ensure smooth operation. Unlock the value and benefits of BZA456A,135 for optimal protection and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides excellent durability and protection for the transient suppression device, ensuring long-term reliability.

Maximum Non Repetitive Peak Reverse Power Dissipation: 24 W

The high maximum non repetitive peak reverse power dissipation of 24W ensures that the device can handle surges and transients effectively without getting damaged.

Maximum Reverse Current: 2 uA

The low maximum reverse current of 2uA ensures minimal leakage current in the device, reducing power consumption and improving overall efficiency.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150°C allows the device to operate reliably in a wide range of temperature conditions, making it suitable for various applications.

Minimum Operating Temperature: -65 °C

The low minimum operating temperature of -65°C ensures that the device can function effectively even in extremely cold environments, enhancing its versatility.

Maximum Clamping Voltage: 8 V

The low maximum clamping voltage of 8V indicates the device's ability to limit the voltage spikes effectively, protecting the connected circuitry from damage.

Technical Specifications

Transient Suppression Devices BZA456A,135 attributes and parameters. Explore more Transient Suppression Devices devices from NXP Semiconductors

Specs

Maximum Clamping Voltage:

8 V

Config:

COMMON ANODE, 4 ELEMENTS

Minimum Diode Capacitance:

240 pF

Diode Element Material:

SILICON

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Reverse Power Dissipation:

24 W

No. of Elements:

4

No. of Terminals:

6

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-65 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity:

UNIDIRECTIONAL

Maximum Power Dissipation:

.72 W

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

5.6 V

Maximum Reverse Current:

2 uA

Sub-Category:

Transient Suppressors

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

TIN

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

BZA456A,135 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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