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BZA418A,165

NXP Semiconductors

BZA418A,165 by NXP Semiconductors

TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 6; Surface Mount: YES; Package Shape: RECTANGULAR;

Median Price

$0.154

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 449 parts In-Stock

1+ parts

-

100+ parts

$0.154

1k+ parts

$0.128

10k+ parts

$0.114

449

-

$0.154

$0.128

$0.114

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,484 parts In-Stock

1+ parts

$0.062

100+ parts

-

1k+ parts

-

10k+ parts

-

4,484

$0.062

-

-

-

Vyrian

USA . 8,355 parts In-Stock

1+ parts

-

100+ parts

-

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-

8,355

-

-

-

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Anansix

USA . 2,584 parts In-Stock

1+ parts

-

100+ parts

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2,584

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-

-

-

ACDS - Activité Composants Distribution Service

France . 760 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

760

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,893 parts In-Stock

1+ parts

$0.058

100+ parts

-

1k+ parts

-

10k+ parts

-

3,893

$0.058

-

-

-

Native Components

USA . 13 parts In-Stock

1+ parts

$0.256

100+ parts

-

1k+ parts

-

10k+ parts

$0.246

13

$0.256

-

-

$0.246

Northwest PG Solutions

USA . 306 parts In-Stock

1+ parts

$0.281

100+ parts

-

1k+ parts

-

10k+ parts

$0.248

306

$0.281

-

-

$0.248

AZTECH Wire

Italy . 40 parts In-Stock

1+ parts

$14.690

100+ parts

-

1k+ parts

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40

$14.690

-

-

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UNI Independent Distributors

Spain . 5,470 parts In-Stock

1+ parts

-

100+ parts

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5,470

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Perfect Parts

USA . 851 parts In-Stock

1+ parts

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851

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Cyclops Electronics Ltd (Excess)

UK . 760 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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760

-

-

-

-

Technical Specifications

Transient Suppression Devices BZA418A,165 attributes and parameters. Explore more Transient Suppression Devices devices from NXP Semiconductors

Specs

Maximum Clamping Voltage:

27 V

Config:

COMMON ANODE, 4 ELEMENTS

Diode Element Material:

SILICON

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Reverse Power Dissipation:

19.6 W

No. of Elements:

4

No. of Terminals:

6

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity:

UNIDIRECTIONAL

Maximum Power Dissipation:

.72 W

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

18 V

Sub-Category:

Transient Suppressors

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

TIN

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

BZA418A,165 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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