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BUK9MRR-65PKK,518

NXP Semiconductors

BUK9MRR-65PKK,518 by NXP Semiconductors

BUK9MRR-65PKK,518 from NXP Semiconductors is an N-channel power FET designed for enhancement mode operation. It supports a max drain current of 4.8 A and power dissipation of 3.2 W, making it ideal for efficient switching applications in high-temperature environments up to 150 °C.

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Lifecycle Status

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4

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1k+

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Chip Stock

USA . 102,000 parts In-Stock

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Vyrian

USA . 6,707 parts In-Stock

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Anansix

USA . 1,066 parts In-Stock

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Digiode

USA . 199 parts In-Stock

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AZTECH Wire

Italy . 622 parts In-Stock

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$14.290

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Native Components

USA . 207 parts In-Stock

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$17.150

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Northwest PG Solutions

USA . 1,116 parts In-Stock

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$16.978

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One Stop Electronics

USA . 1,329 parts In-Stock

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$26.050

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Component Stockers USA

USA . 593 parts In-Stock

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$99.990

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Corphita

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UNI Independent Distributors

Spain . 1,877 parts In-Stock

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Microchip USA

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Overview

Elevate your designs with the BUK9MRR-65PKK,518 from NXP Semiconductors—a trusted leader in high-performance electronic solutions. This top-tier power FET combines reliability and efficiency, perfect for a range of applications from automotive to consumer electronics. Enjoy superior thermal management and robust performance, ensuring your projects achieve longevity and excellence. Choose NXP for quality that powers innovation!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance and higher efficiency, making them ideal for switching applications.

Surface Mount: YES

Surface mount design allows for compact assembly, improved thermal performance, and efficient use of PCB space.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides better control and high transconductance, which is essential for digital and analog applications.

Maximum Drain Current (Abs) (ID): 4.8 A

With a maximum drain current of 4.8 A, this FET can handle substantial loads, making it suitable for a variety of high-power applications.

Maximum Power Dissipation (Abs): 3.2 W

A power dissipation of 3.2 W ensures reliable performance under load, reducing the risk of overheating during operation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology contributes to high input impedance and low power consumption, enhancing overall circuit efficiency.

Maximum Operating Temperature: 150 °C

Operating at temperatures up to 150 °C enables use in a wide range of environments without compromising reliability.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, it is designed for standard soldering processes, simplifying assembly and ensuring compatibility.

Maximum Time At Peak Reflow Temperature (s): 30

Allowing a maximum peak reflow time of 30 seconds helps prevent damage during soldering, assuring product longevity.

Peak Reflow Temperature: 260 °C

A peak reflow temperature of 260 °C supports compatibility with lead-free soldering processes, crucial for environmentally-conscious manufacturing.

Technical Specifications

Power Field Effect Transistors (FET) BUK9MRR-65PKK,518 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Maximum Drain Current (Abs) (ID):

4.8 A

Maximum Drain Current (ID):

4.8 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Moisture Sensitivity Level (MSL):

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

BUK9MRR-65PKK,518 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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