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BUK9MGP-55PTS,518

NXP Semiconductors

BUK9MGP-55PTS,518 by NXP Semiconductors

BUK9MGP-55PTS,518 from NXP Semiconductors is an N-channel power FET designed for enhancement mode operation. It supports a max drain current of 16.9 A and power dissipation of 5.2 W, making it ideal for high-efficiency applications in electronics. With a peak reflow temp of 260 °C, it's suitable for surface mount technology.

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4

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1k+

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Chip Stock

USA . 141,000 parts In-Stock

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Vyrian

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Anansix

USA . 2,544 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 523 parts In-Stock

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$17.670

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Ampacity Inc.

Singapore . 1,095 parts In-Stock

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$27.050

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One Stop Electronics

USA . 658 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 15,771 parts In-Stock

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UNI Independent Distributors

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Corphita

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Native Components

USA . 984 parts In-Stock

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Northwest PG Solutions

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Microchip USA

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Overview

Elevate your designs with the BUK9MGP-55PTS,518 from NXP Semiconductors—where quality meets innovation. This powerful N-channel FET is engineered for reliability and efficiency, making it ideal for a variety of applications, from motor control to power management. With NXP’s trusted expertise, enjoy enhanced performance, reduced thermal stress, and seamless integration into your projects. Choose BUK9MGP-55PTS,518 for unmatched durability and superior value!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-Channel FETs are known for their high efficiency and better electron mobility, making them a preferred choice for high-speed switching applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier automated assembly, making the integration of this FET into circuits more efficient.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control and lower power consumption in the OFF state, contributing to improved circuit performance.

Maximum Drain Current (Abs) (ID): 16.9 A

With a maximum drain current of 16.9 A, this FET can handle significant loads, making it suitable for high-current applications.

Maximum Power Dissipation (Abs): 5.2 W

A power dissipation capability of 5.2 W ensures the product can handle thermal stress without failure, enhancing reliability in various applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high input impedance and fast switching, making it ideal for modern electronic applications.

Maximum Operating Temperature: 150 °C

Operating at temperatures up to 150 °C extends the range of applications for this FET, making it suitable for high-temperature environments.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates a moderate sensitivity to moisture, ensuring it can be handled with reasonable care, maintaining product integrity during assembly.

Maximum Time At Peak Reflow Temperature (s): 30

This specification allows for flexibility during the soldering process, ensuring consistent quality in assembly without damaging the FET.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C ensures compatibility with modern soldering processes, enhancing manufacturability.

Technical Specifications

Power Field Effect Transistors (FET) BUK9MGP-55PTS,518 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Maximum Drain Current (Abs) (ID):

16.9 A

Maximum Drain Current (ID):

16.9 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Moisture Sensitivity Level (MSL):

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

BUK9MGP-55PTS,518 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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