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BUK9635-100A,118

NXP Semiconductors

BUK9635-100A,118 by NXP Semiconductors

NXP Semiconductors' BUK9635-100A,118 is a N-channel Power FET with 100V DS breakdown voltage and 165A IDM. Ideal for switching applications, it features a built-in diode, 0.039 ohm RDS(on), and 175°C max operating temp.

Median Price

$1.420

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 40 parts In-Stock

1+ parts

-

100+ parts

$1.420

1k+ parts

$1.180

10k+ parts

$1.050

40

-

$1.420

$1.180

$1.050

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.531

100+ parts

-

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50

$0.531

-

-

-

Digiode

USA . 4,072 parts In-Stock

1+ parts

$0.566

100+ parts

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4,072

$0.566

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Vyrian

USA . 7,620 parts In-Stock

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7,620

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VNN

France . 1,688 parts In-Stock

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1,688

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Anansix

USA . 318 parts In-Stock

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318

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Distributors (Availability)

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Ampacity Inc.

Singapore . 7 parts In-Stock

1+ parts

$0.510

100+ parts

-

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7

$0.510

-

-

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Continental Prestige Electronics

USA . 5,541 parts In-Stock

1+ parts

$0.531

100+ parts

-

1k+ parts

-

10k+ parts

$0.521

5,541

$0.531

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-

$0.521

Argo Parts USA

USA . 4,266 parts In-Stock

1+ parts

$0.531

100+ parts

-

1k+ parts

-

10k+ parts

$0.515

4,266

$0.531

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$0.515

Corphita

USA . 3,294 parts In-Stock

1+ parts

$0.536

100+ parts

-

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3,294

$0.536

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Corohmni

South Africa . 19 parts In-Stock

1+ parts

$1.637

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19

$1.637

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Aztec Data Supply Inc.

USA . 53,522 parts In-Stock

1+ parts

$1.890

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53,522

$1.890

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Microchip USA

USA . 8,500 parts In-Stock

1+ parts

$3.705

100+ parts

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8,500

$3.705

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AZTECH Wire

Italy . 864 parts In-Stock

1+ parts

$4.929

100+ parts

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864

$4.929

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UNI Independent Distributors

Spain . 3,334 parts In-Stock

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3,334

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Perfect Parts

USA . 7 parts In-Stock

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7

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Overview

Enhance your power applications with the BUK9635-100A,118 by NXP Semiconductors. This high-quality Power Field Effect Transistor offers superior performance and reliability for switching operations. With a maximum drain current of 41A and a low on-resistance of 0.039 ohm, this N-channel transistor is designed to handle high-power tasks with ease. Its single configuration with built-in diode simplifies circuit design while its compact package ensures easy installation. Trust NXP Semiconductors to deliver cutting-edge technology and exceptional value for all your power needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the FET lightweight and durable, ideal for applications requiring portability and reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high efficiency and fast switching speeds, making them suitable for various switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse current flow, making integration easier and enhancing overall system reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers excellent performance in rapidly switching circuits, ensuring efficient operation.

Minimum DS Breakdown Voltage: 100 V

With a minimum breakdown voltage of 100V, this FET can handle high voltage applications with ease, providing reliable performance under demanding conditions.

Surface Mount: YES

The surface-mount design allows for easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation ensures low on-resistance and fast switching characteristics, making this FET suitable for high-performance applications.

Maximum Pulsed Drain Current (IDM): 165 A

The high pulsed drain current rating of 165A allows this FET to handle sudden surge currents, making it suitable for applications with varying load conditions.

Avalanche Energy Rating (EAS): 125 mJ

The high avalanche energy rating of 125mJ provides protection against voltage spikes and transient events, ensuring the reliability and longevity of the FET.

Maximum Drain Current (Abs) (ID): 40 A

With a maximum drain current rating of 40A, this FET can handle high continuous current flow, making it suitable for power applications.

No. of Terminals: 2

The two-terminal configuration simplifies connectivity and reduces the complexity of circuit design, making this FET easy to integrate into various systems.

Maximum Power Dissipation (Abs): 150 W

The high power dissipation rating of 150W allows this FET to handle high power levels without overheating, ensuring reliable operation under heavy loads.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for compact designs where size constraints are a concern.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and low power consumption, making this FET suitable for energy-efficient applications.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175°C, this FET can operate in high-temperature environments without compromising performance, ensuring reliability under extreme conditions.

Transistor Element Material: SILICON

Silicon transistor element material offers high performance and reliability, making this FET a durable and robust choice for various applications.

Terminal Finish: Tin (Sn)

The tin terminal finish provides good solderability and corrosion resistance, ensuring secure connections and long-term reliability.

Maximum Drain Current (ID): 41 A

With a maximum drain current rating of 41A, this FET can handle high current loads with ease, making it suitable for power-intensive applications.

Maximum Drain-Source On Resistance: 0.039 ohm

The low drain-source on-resistance of 0.039 ohm minimizes power loss and improves efficiency, making this FET ideal for high-performance applications.

Terminal Position: SINGLE

The single terminal position simplifies installation and reduces the risk of wiring errors, ensuring easy integration into existing systems.

Case Connection: DRAIN

The drain case connection simplifies the circuit layout and enhances thermal management, improving overall performance and reliability.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures proper soldering and prevents thermal damage, ensuring reliable connections during assembly.

Peak Reflow Temperature °C: 245

The high peak reflow temperature of 245°C allows for reliable soldering and ensures stable connections, even in high-temperature environments.

Technical Specifications

Power Field Effect Transistors (FET) BUK9635-100A,118 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Avalanche Energy Rating (EAS):

125 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

40 A

Maximum Drain Current (ID):

41 A

Maximum Drain-Source On Resistance:

.039 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

165 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BUK9635-100A,118 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.75

SB

8541.29.00.80

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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