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BTS6302UJ

NXP Semiconductors

BTS6302UJ by NXP Semiconductors

WIDE BAND MEDIUM POWER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Body Material: PLASTIC/EPOXY; Screening Level: IEC-60134; Maximum Operating Frequency: 5000 MHz;

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 5,912 parts In-Stock

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5,912

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Anansix

USA . 2,789 parts In-Stock

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2,789

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Vyrian

USA . 1,944 parts In-Stock

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1,944

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Digiode

USA . 1,900 parts In-Stock

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1,900

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,408 parts In-Stock

1+ parts

$12.000

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1,408

$12.000

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AZTECH Wire

Italy . 338 parts In-Stock

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$18.010

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338

$18.010

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Component Stockers USA

USA . 5,079 parts In-Stock

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$20.410

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$20.410

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Native Components

USA . 163 parts In-Stock

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$52.487

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$50.387

163

$52.487

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$50.387

Northwest PG Solutions

USA . 997 parts In-Stock

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$57.736

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997

$57.736

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UNI Independent Distributors

Spain . 3,091 parts In-Stock

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Corphita

USA . 1,272 parts In-Stock

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Technical Specifications

RF & Microwave Amplifiers BTS6302UJ attributes and parameters. Explore more RF & Microwave Amplifiers devices from NXP Semiconductors

Specs

Characteristic Impedance:

50 ohm

Construction:

COMPONENT

Gain:

33.8 dB

Maximum Input Power (CW):

10 dBm

Mounting Feature:

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Frequency:

5000 MHz

Minimum Operating Frequency:

2300 MHz

Maximum Operating Temperature:

115 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

Package Equivalence Code:

LCC16,.12SQ,20

Power Supplies (V):

5

RF or Microwave Device Type:

Screening Level:

Maximum Supply Current:

120 mA

Maximum Voltage Standing Wave Ratio:

1.67

Trade Compliance

BTS6302UJ RF & Microwave trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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