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BLF884P,112

NXP Semiconductors

BLF884P,112 by NXP Semiconductors

BLF884P,112 by NXP Semiconductors is an N-channel power FET designed for high-performance applications. It operates in enhancement mode with a max temp of 200 °C and withstands peak reflow temps up to 260 °C for reliable surface mount integration. Ideal for RF amplification and switching tasks.

Median Price

$122.110

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 60 parts In-Stock

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$94.431

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$90.293

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60

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Verical

USA . 55 parts In-Stock

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$95.671

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$91.478

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RFMW

USA . 133 parts In-Stock

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$148.550

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DigiKey

USA . 108 parts In-Stock

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$184.490

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$147.302

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Digiode

USA . 2,304 parts In-Stock

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$89.709

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Vyrian

USA . 2,975 parts In-Stock

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Anansix

USA . 1,180 parts In-Stock

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Flip Electronics

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Corphita

USA . 4,108 parts In-Stock

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$84.988

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Component Stockers USA

USA . 167 parts In-Stock

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$144.760

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$135.590

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167

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Microchip USA

USA . 8,323 parts In-Stock

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$233.970

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UNI Independent Distributors

Spain . 2,441 parts In-Stock

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Perfect Parts

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GreenTree Electronics

Israel . 438 parts In-Stock

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438

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Northwest PG Solutions

USA . 327 parts In-Stock

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Native Components

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Overview

Unlock the power of innovation with the BLF884P,112 from NXP Semiconductors, a trusted leader in cutting-edge technology. This high-performance N-channel Power FET is designed for efficiency and reliability, making it ideal for a wide range of applications like RF amplification and industrial automation. Experience superior thermal management and durability, ensuring your projects run smoothly and efficiently, while benefiting from NXP's commitment to quality and excellence.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high electron mobility, allowing for faster switching speeds and improved efficiency in power applications.

Surface Mount: YES

Surface mount technology (SMT) allows for a more compact design, improving board space utilization and making it easier to automate assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs provide better control and performance in amplifying and switching applications, making them suitable for a wide range of circuits.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high input impedance and low power consumption, making these transistors ideal for battery-operated devices and low-power applications.

Maximum Operating Temperature: 200 °C

With a maximum operating temperature of 200 °C, this FET is suitable for high-temperature environments, enhancing reliability in demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

A peak reflow time of 30 seconds ensures that the product can withstand soldering processes without compromising its integrity or performance.

Peak Reflow Temperature °C: 260

Capable of enduring a peak reflow temperature of 260 °C, this FET can be integrated into a variety of manufacturing processes, ensuring versatility in application.

Technical Specifications

Power Field Effect Transistors (FET) BLF884P,112 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

BLF884P,112 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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