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BGX7101HN/1,118

NXP Semiconductors

BGX7101HN/1,118 by NXP Semiconductors

BGX7101HN/1,118 by NXP Semiconductors is a surface-mount RF modulator with a max input power of 16 dBm and operates b/w 400 MHz to 4 GHz. It features a low VSWR of 1.92 and utilizes I/Q modulation for efficient signal processing. Ideal for high-frequency communication applications.

Median Price

$2.376

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,777 parts In-Stock

1+ parts

-

100+ parts

$2.240

1k+ parts

$2.010

10k+ parts

$1.890

3,777

-

$2.240

$2.010

$1.890

Verical

USA . 3,777 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.513

10k+ parts

$2.362

3,777

-

-

$2.513

$2.362

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,131 parts In-Stock

1+ parts

$2.375

100+ parts

-

1k+ parts

-

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1,131

$2.375

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-

-

Vyrian

USA . 3,677 parts In-Stock

1+ parts

-

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3,677

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-

-

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Anansix

USA . 2,149 parts In-Stock

1+ parts

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2,149

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,479 parts In-Stock

1+ parts

$2.250

100+ parts

-

1k+ parts

-

10k+ parts

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3,479

$2.250

-

-

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Northwest PG Solutions

USA . 536 parts In-Stock

1+ parts

$2.376

100+ parts

-

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536

$2.376

-

-

-

Component Stockers USA

USA . 5,404 parts In-Stock

1+ parts

$2.810

100+ parts

$2.630

1k+ parts

$2.380

10k+ parts

-

5,404

$2.810

$2.630

$2.380

-

AZTECH Wire

Italy . 342 parts In-Stock

1+ parts

$8.240

100+ parts

-

1k+ parts

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10k+ parts

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342

$8.240

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Microchip USA

USA . 7,407 parts In-Stock

1+ parts

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7,407

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UNI Independent Distributors

Spain . 6,506 parts In-Stock

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6,506

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Native Components

USA . 661 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$2.095

10k+ parts

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661

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$2.095

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Overview

Unlock the potential of your wireless applications with the BGX7101HN/1,118 from NXP Semiconductors. Renowned for their commitment to quality and innovation, NXP delivers a powerful modulator that ensures reliable performance in demanding environments. With exceptional range and efficient signal processing, this versatile device enhances communication systems, making it ideal for industrial, automotive, and IoT solutions. Experience unmatched value and elevate your projects with confidence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material for the package body ensures a lightweight yet robust construction, enhancing the product's longevity and reliability in various environmental conditions.

Maximum Input Power (CW): 16 dBm

With a maximum input power capability of 16 dBm, this modulator/demodulator can handle a significant power level, making it suitable for advanced RF applications.

Screening Level: IEC-60134

Compliance with the IEC-60134 screening level indicates high reliability and suitable performance in critical communication systems, ensuring it meets industry standards.

Maximum Voltage Standing Wave Ratio: 1.92

A low maximum voltage standing wave ratio of 1.92 demonstrates efficient power transfer, minimizing signal reflections, which enhances overall system performance.

Construction: COMPONENT

Being a component construction type suggests easy integration into various circuit designs, facilitating flexibility in system development.

No. of Terminals: 24

With 24 terminals, this device offers a variety of connection options, enabling complex interfacing and increased functionality in different applications.

Modulation Technique: I/Q

Using I/Q modulation techniques allows for efficient signal processing and improved spectral efficiency, making the product ideal for communication systems with stringent bandwidth requirements.

RF or Microwave Device Type: MODULATOR

As a modulator, it plays a crucial role in converting signals for transmission, making it essential for RF communication systems.

Characteristic Impedance: 50 ohm

Designed with a characteristic impedance of 50 ohm, this product ensures compatibility with standard RF systems, facilitating seamless integration.

Minimum Operating Frequency: 400 MHz

The minimum operating frequency of 400 MHz allows for broad application in modern RF communication systems, across various frequency bands.

Mounting Feature: SURFACE MOUNT

The surface mount feature enables compact installation on PCBs, optimizing space and allowing for high-density designs.

Maximum Operating Frequency: 4000 MHz

Capable of operating at a maximum frequency of 4000 MHz, this product is suitable for diverse high-frequency applications, including advanced telecommunications.

Technical Specifications

RF/Microwave Modulator/Demodulators BGX7101HN/1,118 attributes and parameters. Explore more RF/Microwave Modulator/Demodulators devices from NXP Semiconductors

Specs

Characteristic Impedance:

50 ohm

Construction:

COMPONENT

Maximum Input Power (CW):

16 dBm

Modulation Technique:

I/Q

Mounting Feature:

No. of Terminals:

24

Maximum Operating Frequency:

4000 MHz

Minimum Operating Frequency:

400 MHz

Package Body Material:

Package Equivalence Code:

LCC24,.16SQ,20

RF or Microwave Device Type:

Screening Level:

Maximum Voltage Standing Wave Ratio:

1.92

Trade Compliance

BGX7101HN/1,118 RF & Microwave trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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