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BGS8458Z

NXP Semiconductors

BGS8458Z by NXP Semiconductors

WIRELESS LAN CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 6; Package Code: HVSON; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,640 parts In-Stock

1+ parts

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5,640

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Digiode

USA . 4,683 parts In-Stock

1+ parts

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4,683

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Anansix

USA . 2,157 parts In-Stock

1+ parts

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2,157

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 165 parts In-Stock

1+ parts

$0.303

100+ parts

-

1k+ parts

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165

$0.303

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Northwest PG Solutions

USA . 637 parts In-Stock

1+ parts

$3.183

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637

$3.183

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$15.176

100+ parts

$13.810

1k+ parts

$12.444

10k+ parts

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1,000

$15.176

$13.810

$12.444

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AZTECH Wire

Italy . 569 parts In-Stock

1+ parts

$18.120

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569

$18.120

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One Stop Electronics

USA . 535 parts In-Stock

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$289.000

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535

$289.000

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UNI Independent Distributors

Spain . 5,613 parts In-Stock

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5,613

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Native Components

USA . 652 parts In-Stock

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$2.807

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652

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$2.807

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Corphita

USA . 587 parts In-Stock

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587

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Technical Specifications

Network Interfaces BGS8458Z attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-N6

Length:

1.4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.33 mm

Nominal Supply Voltage:

3.6 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Width:

1.2 mm

Trade Compliance

BGS8458Z Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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