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BGA3015

NXP Semiconductors

BGA3015 by NXP Semiconductors

WIDE BAND MEDIUM POWER; JESD-609 Code: e3; Terminal Finish: Tin (Sn);

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,521 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,521

-

-

-

-

Flip Electronics

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Digiode

USA . 453 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

453

-

-

-

-

Vyrian

USA . 160 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

160

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 235 parts In-Stock

1+ parts

$6.473

100+ parts

-

1k+ parts

-

10k+ parts

-

235

$6.473

-

-

-

One Stop Electronics

USA . 722 parts In-Stock

1+ parts

$12.000

100+ parts

-

1k+ parts

-

10k+ parts

-

722

$12.000

-

-

-

UNI Independent Distributors

Spain . 7,571 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,571

-

-

-

-

Northwest PG Solutions

USA . 1,956 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$6.343

10k+ parts

-

1,956

-

-

$6.343

-

Corphita

USA . 142 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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142

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-

-

-

Technical Specifications

RF & Microwave Amplifiers BGA3015 attributes and parameters. Explore more RF & Microwave Amplifiers devices from NXP Semiconductors

Specs

JESD-609 Code:

e3

RF or Microwave Device Type:

Terminal Finish:

Tin (Sn)

Trade Compliance

BGA3015 RF & Microwave trade compliance attributes, and parameters.

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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Authentic purchasing experiences

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