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BAT74,215

NXP Semiconductors

BAT74,215 by NXP Semiconductors

BAT74,215 by NXP Semiconductors is a Schottky rectifier diode with 30V peak reverse voltage and 0.2A output current. With 0.005us reverse recovery time, it's ideal for high-speed switching applications in electronics due to its small outline package and low power dissipation of 0.23W.

Median Price

$0.047

Lifecycle Status

Suppliers In-Stock

32

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 128,970 parts In-Stock

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$0.056

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$0.047

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$0.042

Arrow

USA . 123,000 parts In-Stock

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Verical

USA . 123,000 parts In-Stock

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TTI

USA . 108,000 parts In-Stock

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RS (Exports)

UK . 5,580 parts In-Stock

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Farnell

UK . 208 parts In-Stock

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Chip1Stop

Japan . 10 parts In-Stock

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Digiode

USA . 2,604 parts In-Stock

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$0.044

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Nova Conductors

Japan . 78 parts In-Stock

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IBS Electronics

USA . 1,847 parts In-Stock

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$0.420

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$0.364

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$0.123

1,847

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$0.420

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$0.123

NAC Semi

USA . 867,000 parts In-Stock

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ComSIT USA

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A&K Electronics

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Bristol Electronics

USA . 11,215 parts In-Stock

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Chip Stock

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Rotakorn

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Inventory MP

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Vyrian

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ComSIT Distribution GmbH

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PC Components Company LLC

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North Shore Components

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Dan-Mar Components

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Rebound Electronics

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Anansix

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LIBRA Elektronik GmbH

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LWI Electronics Inc

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Prism Electronics

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Italy . 245 parts In-Stock

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Classic Components Corporation

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NexGen Digital

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Semicontronic

India . 136,704 parts In-Stock

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Ampacity Inc.

Singapore . 74,475 parts In-Stock

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Corphita

USA . 4,874 parts In-Stock

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AZTECH Wire

Italy . 5,870 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,336 parts In-Stock

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$0.070

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Argo Parts USA

USA . 149 parts In-Stock

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Modulus Dynamics

Lithuania . 30,623 parts In-Stock

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Corohmni

South Africa . 1,401 parts In-Stock

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Aranea Global

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Advanced Electronics

New Zealand . 66 parts In-Stock

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Continental Prestige Electronics

USA . 4,559 parts In-Stock

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Perfect Parts

USA . 3,373,836 parts In-Stock

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Eastek

USA . 39,000 parts In-Stock

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Glotronic Ltd.

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GreenTree Electronics

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Futuretech Components

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Supply Digital

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Overview

Unleash the power of cutting-edge technology with the NXP Semiconductors BAT74,215 diode. Crafted with precision and expertise, this diode offers unmatched quality and reliability in a compact package. Ideal for a wide range of applications, this diode boasts a fast reverse recovery time and low reverse current, ensuring optimal performance. Experience the value and benefits of superior technology with the BAT74,215 diode from NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides good protection for the diodes and rectifiers, ensuring durability and reliability.

Config: SEPARATE, 2 ELEMENTS

Having separate elements allows for more flexibility in circuit design and helps improve overall performance of the product.

Surface Mount: YES

Being surface mountable makes the product easy to install and can save space on the PCB, making it a convenient choice for compact electronic devices.

Maximum Reverse Recovery Time: 0.005 us

The low reverse recovery time ensures fast switching speeds, making this product suitable for high frequency applications.

Maximum Reverse Current: 2 uA

With a low reverse current, this product offers efficient operation and helps minimize power losses.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy placement and alignment on the PCB, facilitating assembly and improving overall aesthetics.

No. of Terminals: 4

Having 4 terminals provides more connection points, offering versatility in circuit configurations and enhancing compatibility with different devices.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for applications where board space is limited.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand elevated temperatures, ensuring reliable performance in various environments.

Terminal Finish: TIN

The terminal finish of TIN provides good conductivity and corrosion resistance, enhancing the overall performance and longevity of the product.

Terminal Position: DUAL

Having dual terminal positions allows for more flexibility in mounting and connection options, making it easier to integrate into different electronic systems.

Maximum Power Dissipation: 0.23 W

The low power dissipation helps improve energy efficiency and reduces heat generation, ensuring stable operation over extended periods.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time at peak temperature reduces the risk of thermal damage during assembly, ensuring the product's reliability.

Peak Reflow Temperature °C: 260

Being able to withstand peak reflow temperatures of 260°C makes this product suitable for high temperature soldering processes, ensuring a secure connection.

Diode Type: RECTIFIER DIODE

As a rectifier diode, this product is designed to efficiently convert AC to DC, making it a reliable choice for power supply and rectification applications.

Maximum Forward Voltage (VF): 1 V

With a low forward voltage, this product offers minimal voltage drop during operation, ensuring efficient power conversion and minimizing power losses.

Maximum Output Current: 0.2 A

Being able to handle a maximum output current of 0.2A makes this product suitable for low to moderate power applications, providing reliable performance.

Technology: SCHOTTKY

The Schottky technology used in this product offers fast switching speeds and low forward voltage drop, making it ideal for high frequency and low power applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure soldering connections and ease of handling during assembly, enhancing the overall reliability of the product.

No. of Elements: 2

Having 2 elements allows for more efficient operation and performance, offering better control and stability in the circuit.

Maximum Repetitive Peak Reverse Voltage: 30 V

With a high repetitive peak reverse voltage rating, this product can handle higher voltage levels, making it suitable for a wide range of applications.

Maximum Non Repetitive Peak Forward Current: 0.6 A

Being able to withstand a maximum non-repetitive peak forward current of 0.6A ensures the product's reliability under transient conditions and surge events.

Diode Element Material: SILICON

The use of silicon as the diode element material provides good thermal stability and low leakage current, ensuring reliable and consistent performance.

Technical Specifications

Diodes & Rectifiers BAT74,215 attributes and parameters. Explore more Diodes & Rectifiers devices from NXP Semiconductors

Specs

Config:

SEPARATE, 2 ELEMENTS

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

1 V

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Forward Current:

.6 A

No. of Elements:

2

No. of Terminals:

4

Maximum Operating Temperature:

125 Cel

Maximum Output Current:

.2 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Power Dissipation:

.23 W

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

30 V

Maximum Reverse Current:

2 uA

Maximum Reverse Recovery Time:

.005 us

Sub-Category:

Rectifier Diodes

Surface Mount:

YES

Technology:

SCHOTTKY

Terminal Finish:

TIN

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

BAT74,215 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.70

SB

8541.10.00.70

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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