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BA423L

NXP Semiconductors

BA423L by NXP Semiconductors

BA423L by NXP Semiconductors is a single-config microwave mixer diode with 3.5 pF capacitance. It features a glass package, round shape, and no-lead terminal form. Ideal for applications requiring isolated case connection in end-terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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ComSIT Distribution GmbH

Germany . 4,990 parts In-Stock

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Anansix

USA . 1,384 parts In-Stock

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Digiode

USA . 987 parts In-Stock

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987

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VNN

France . 491 parts In-Stock

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Vyrian

USA . 335 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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50

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One Stop Electronics

USA . 1,247 parts In-Stock

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$1.010

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$1.010

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Ampacity Inc.

Singapore . 413 parts In-Stock

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$2.010

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AZTECH Wire

Italy . 424 parts In-Stock

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$15.445

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UNI Independent Distributors

Spain . 6,772 parts In-Stock

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Corphita

USA . 445 parts In-Stock

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445

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Bastille Electronics

Australia . 200 parts In-Stock

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Overview

Imagine a world where high-quality microwave mixer and detector diodes are easily accessible and reliable. NXP Semiconductors brings you the BA423L, a single-config, surface-mount diode with a round package shape made of durable glass. With a maximum diode capacitance of 3.5 pF, this product offers exceptional performance in various applications. Whether you're designing radar systems or communication devices, the BA423L provides value, efficiency, and peace of mind. Trust NXP Semiconductors to deliver premium components for your projects.

Feature Benefit Bullets

Package Body Material: GLASS

The use of glass for the package body material provides good insulation and protection for the diode, ensuring reliable performance and longevity.

Config: SINGLE

The single configuration simplifies the setup and integration of the diode into a circuit, making it easier to use in various applications.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on circuit boards, saving space and making the overall design more compact.

Maximum Diode Capacitance: 3.5 pF

Having a low maximum diode capacitance enhances the high-frequency performance of the diode, making it suitable for applications requiring fast response times.

Package Shape: ROUND

The round package shape provides uniform stress distribution and better thermal management, contributing to the overall reliability of the diode.

No. of Terminals: 2

Having only two terminals simplifies the connection and wiring of the diode in a circuit, reducing the chances of errors during installation.

Package Style (Meter): LONG FORM

The long form package style allows for better heat dissipation and improved electrical performance, making it suitable for high-power applications.

Terminal Position: END

The end terminal position makes it easier to connect the diode to other components in the circuit, providing a more straightforward assembly process.

Case Connection: ISOLATED

An isolated case connection helps prevent signal interference and ensures stable performance of the diode in sensitive applications.

Diode Type: MIXER DIODE

Being a mixer diode, it is specifically designed for RF and microwave applications, providing excellent frequency mixing capabilities and signal detection.

Terminal Form: NO LEAD

The absence of leads simplifies the installation process and reduces the risk of lead-related failures, ensuring a reliable connection in the circuit.

Diode Element Material: SILICON

The silicon diode element material offers good stability and performance over a wide temperature range, making it suitable for various operating conditions.

Technical Specifications

Microwave Mixer & Detector Diodes BA423L attributes and parameters. Explore more Microwave Mixer & Detector Diodes devices from NXP Semiconductors

Specs

Case Connection:

ISOLATED

Config:

SINGLE

Maximum Diode Capacitance:

3.5 pF

Diode Element Material:

SILICON

Diode Type:

JESD-30 Code:

O-LELF-N2

No. of Elements:

1

No. of Terminals:

2

Package Body Material:

GLASS

Package Shape:

Package Style (Meter):

LONG FORM

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

Terminal Position:

END

Trade Compliance

BA423L Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.60

SB

8541.10.00.60

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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