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AU5783D

NXP Semiconductors

AU5783D by NXP Semiconductors

INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,254 parts In-Stock

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3,254

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Anansix

USA . 2,748 parts In-Stock

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2,748

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ComSIT Distribution GmbH

Germany . 292 parts In-Stock

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292

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ComSIT USA

USA . 292 parts In-Stock

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292

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ECAB

Sweden . 70 parts In-Stock

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70

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Vyrian

USA . 21 parts In-Stock

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21

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Distributors (Availability)

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One Stop Electronics

USA . 1,312 parts In-Stock

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$28.500

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$28.500

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Native Components

USA . 261 parts In-Stock

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$107.427

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$103.130

261

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$103.130

Northwest PG Solutions

USA . 360 parts In-Stock

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$118.170

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360

$118.170

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UNI Independent Distributors

Spain . 5,811 parts In-Stock

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Corphita

USA . 4,097 parts In-Stock

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Perfect Parts

USA . 2,416 parts In-Stock

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Metaverse IC Inc.

Canada . 1,500 parts In-Stock

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1,500

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Technical Specifications

Other Function Interface ICs AU5783D attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

16 V

Minimum Supply Voltage:

7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

AU5783D Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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