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ADC1413D125HN/C1,5

NXP Semiconductors

ADC1413D125HN/C1,5 by NXP Semiconductors

ADC1413D125HN/C1,5 from NXP is a 14-bit A/D converter with a max linearity error of just 0.03%. It operates b/w -40 °C to 85 °C and supports dual functions in a compact chip carrier package. Ideal for industrial applications requiring precise analog-to-digital conversion.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 6,616 parts In-Stock

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Digiode

USA . 469 parts In-Stock

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Anansix

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Microchip USA

USA . 4,390 parts In-Stock

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AZTECH Wire

Italy . 696 parts In-Stock

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One Stop Electronics

USA . 573 parts In-Stock

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$35.000

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Native Components

USA . 499 parts In-Stock

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499

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UNI Independent Distributors

Spain . 487 parts In-Stock

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Corphita

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Northwest PG Solutions

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Overview

Unlock unparalleled precision and efficiency with the ADC1413D125HN/C1,5 from NXP Semiconductors. Renowned for their commitment to quality, NXP delivers this high-performance analog-to-digital converter, ideal for industrial applications that demand accuracy in extreme temperatures. With 14 bits of resolution and a compact design, this converter enhances your systems while reducing power consumption, ensuring you stay ahead in innovation and reliability. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures that the product is lightweight and provides good protection against environmental factors, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for a compact design and easier integration into modern PCB layouts, saving space and potentially reducing manufacturing costs.

No. of Functions: 2

Having multiple functions can help reduce component count in a design, leading to simplified circuit complexity and potentially lower manufacturing costs.

Package Shape: SQUARE

The square package shape aids in efficient use of PCB space, facilitating easier routing and placement on circuit boards.

No. of Bits: 14

A 14-bit resolution provides high precision in signal conversion, making this product ideal for applications that require detailed data acquisition.

Maximum Linearity Error (EL): 0.03%

A low maximum linearity error ensures highly accurate conversion, which is critical for applications that demand high fidelity in signal measurement.

Power Supplies (V): 1.8, 3

Supports dual power supply options, offering flexibility in system designs and compatibility with various voltage levels.

No. of Terminals: 56

A higher number of terminals allows for more connectivity options, accommodating various configurations and enhancing the design's versatility.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging is beneficial for applications requiring greater thermal performance and reduced parasitic inductance.

Maximum Operating Temperature: 85 °C

An extended maximum operating temperature allows the device to function in more demanding environments, ensuring reliability in industrial applications.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes this converter suitable for extreme conditions, enhancing its applicability in rugged environments.

Terminal Position: QUAD

Quad terminal positioning enhances ease of soldering and improves mechanical stability, which is particularly useful in automated assembly processes.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, this product is ideal for applications that require robustness and stability under varying environmental conditions.

Maximum Analog Input Voltage: 3.4 V

Handling up to 3.4 V for analog inputs ensures compatibility with a wide range of sensors and other input devices, providing flexibility in design.

Terminal Form: NO LEAD

No-lead terminals contribute to a smaller footprint and reduced parasitic effects, making the device more suitable for high-frequency applications.

Converter Type: A/D CONVERTER

As an A/D converter, the product is essential for converting analog signals into digital forms, making it indispensable for digital signal processing applications.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY, GRAY CODE

Multiple output bit code options enhance compatibility with diverse digital systems and applications, allowing for easier integration in various projects.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch is suitable for high-density applications, making it a great choice for modern electronic designs where space is a premium.

Technical Specifications

Analog-to-Digital Converters ADC1413D125HN/C1,5 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

2

No. of Bits:

14

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary, Gray Code

Maximum Linearity Error (EL):

0.03 %

Electrical Specifications

Power Supplies:

1.8,3 V

Maximum Analog Input Voltage:

3.4 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

56

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC56,.31SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N56

Qualified:

No

Trade Compliance

ADC1413D125HN/C1,5 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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