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A7005CGHN1

NXP Semiconductors

A7005CGHN1 by NXP Semiconductors

A7005CGHN1 by NXP Semiconductors is an 8-bit microcontroller designed for versatile applications. It operates b/w 1.62V and 5.5V, features a max temp of 85 °C, and includes ADC channels for enhanced functionality. Ideal for compact, surface-mount designs with a quad terminal layout.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Anansix

USA . 2,372 parts In-Stock

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Digiode

USA . 1,859 parts In-Stock

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Vyrian

USA . 27 parts In-Stock

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Native Components

USA . 159 parts In-Stock

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$0.162

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$0.156

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Northwest PG Solutions

USA . 987 parts In-Stock

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$0.178

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One Stop Electronics

USA . 702 parts In-Stock

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$20.000

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UNI Independent Distributors

Spain . 6,403 parts In-Stock

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Corphita

USA . 2,619 parts In-Stock

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Overview

Unlock a world of possibilities with the A7005CGHN1 microcontroller from NXP Semiconductors, where cutting-edge technology meets unmatched reliability. Designed for diverse applications, this versatile powerhouse ensures seamless performance in everything from consumer electronics to industrial automation. With low power consumption and robust operation in challenging environments, it empowers you to innovate while reducing costs—perfect for forward-thinking businesses aiming for excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and protection against environmental factors, making the microcontroller suitable for various applications.

Surface Mount: YES

Surface mount technology allows for smaller PCB designs which can lead to reduced overall product size and improved performance.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V allows compatibility with a wide range of power supplies, suitable for various applications.

Package Shape: SQUARE

The square package shape optimizes space on the PCB and offers consistent thermal performance.

Bit Size: 8

An 8-bit architecture is often sufficient for basic control tasks and embedded applications, offering a balance of ease of use and performance.

Power Supplies (V): 1.8/5

Dual voltage supply options provide flexibility in design, allowing the microcontroller to function in power-sensitive applications.

No. of Terminals: 32

A 32-terminal configuration allows for a good range of interfacing options and peripheral connections, making the microcontroller versatile.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging is ideal for applications requiring high integration and reduced signal integrity issues.

Minimum Supply Voltage: 1.62 V

Low minimum supply voltage makes this microcontroller suitable for battery-operated devices, extending battery life.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this microcontroller is suitable for use in warm environments, increasing its adaptability.

CPU Family: 8051

The 8051 CPU family has a rich history in microcontroller applications, ensuring ample support and resources for developers.

Minimum Operating Temperature: -25 °C

An extended temperature range enables this microcontroller to operate in harsh environmental conditions, suitable for outdoor or industrial applications.

ADC Channels: YES

Integrated ADC channels enhance the microcontroller's ability to interface with the analog world, making it versatile for sensor applications.

Terminal Position: QUAD

Quad terminal positioning provides ease of routing on the PCB, simplifying layout design and ensuring reliability.

Peripheral IC Type: MICROCONTROLLER

Being categorized as a microcontroller allows this product to effectively manage various peripheral devices, enhancing its functionality.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this microcontroller ideal for portable and sensitive applications.

Terminal Form: NO LEAD

No-lead configurations enhance thermal performance and increase the ability to dissipate heat, promoting longevity and reliability.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm is suitable for compact designs, allowing for high-density arrangements on PCBs.

Speed: 62 rpm

A speed of 62 rpm allows for satisfactory processing capabilities for many common tasks, ensuring efficiency in applications.

Technical Specifications

Microcontrollers A7005CGHN1 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

8051

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Speed:

62 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.62 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Peripheral IC Type:

Trade Compliance

A7005CGHN1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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