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A7001CMHN1

NXP Semiconductors

A7001CMHN1 by NXP Semiconductors

A7001CMHN1 by NXP Semiconductors is an 8-bit microcontroller designed for robust applications, operating b/w -25 °C and 85 °C. It features a supply voltage range of 1.8V to 5.5V and includes ADC channels for enhanced functionality. Ideal for compact devices, it comes in a no-lead chip carrier package with 32 terminals.

Median Price

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1k+

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Digiode

USA . 3,307 parts In-Stock

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Anansix

USA . 2,349 parts In-Stock

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Vyrian

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EMSNET

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Native Components

USA . 698 parts In-Stock

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$0.119

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Northwest PG Solutions

USA . 952 parts In-Stock

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One Stop Electronics

USA . 1,083 parts In-Stock

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$4.000

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A-Z Elektronik GmbH

Germany . 7,190 parts In-Stock

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Corphita

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Alle Elektronik GmbH

Germany . 4,793 parts In-Stock

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UNI Independent Distributors

Spain . 2,096 parts In-Stock

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Authorized Procurement Solutions

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Overview

Unlock unparalleled performance with the A7001CMHN1 microcontroller from NXP Semiconductors, a leader in innovative solutions. Designed for versatility and efficiency, this compact powerhouse excels in various applications, from smart home devices to industrial automation. With its robust temperature range and reliable power supply options, you can trust that your projects will run smoothly, delivering unmatched value and long-lasting benefits for your business. Experience the NXP advantage today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material enhances protection against environmental factors, increasing reliability in various applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern PCB layouts, making it suitable for space-constrained applications.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage allows for operation with a range of standard power supplies, providing flexibility in design.

Package Shape: SQUARE

The square package shape facilitates optimal space utilization on PCBs, enabling efficient layout arrangements.

Bit Size: 8

The 8-bit architecture is ideal for basic control applications, offering a good balance of performance and simplicity.

Power Supplies: 1.8/5 V

Support for dual voltage levels (1.8V and 5V) enhances versatility in various circuit designs and lower power applications.

No. of Terminals: 32

With 32 terminals, this microcontroller provides ample I/O options for connecting to peripherals and other devices.

Package Style (Meter): CHIP CARRIER

The chip carrier package style allows for efficient heat dissipation and is well-suited for low-power applications.

Minimum Supply Voltage: 1.62 V

The low minimum supply voltage extends battery life in portable devices, making it an excellent choice for battery-operated designs.

Maximum Operating Temperature: 85 °C

Operating at higher temperatures ensures reliability in tough environments, making it suitable for industrial applications.

CPU Family: 8051

The well-established 8051 CPU family offers extensive resources and community support, simplifying development and reducing time to market.

Minimum Operating Temperature: -25 °C

The ability to function at low temperatures makes this microcontroller suitable for outdoor and harsh environmental applications.

ADC Channels: YES

Having ADC channels allows for seamless integration of analog signals, enhancing its capability in sensor-driven applications.

Terminal Position: QUAD

Quad terminal position aids in efficient layout designs, improving connection reliability and reducing signal loss.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates computation and control, reducing component count and system complexity.

Technology: CMOS

CMOS technology ensures low power consumption and high performance, making it an ideal choice for energy-sensitive applications.

Terminal Form: NO LEAD

The no-lead design reduces the footprint and enhances compatibility with modern manufacturing processes.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch enables higher density layouts, supporting compact designs without sacrificing performance.

Speed: 62 rpm

A speed of 62 rpm ensures adequate processing capability for various control tasks, making it a practical choice for many applications.

Technical Specifications

Microcontrollers A7001CMHN1 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

8051

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Speed:

62 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.62 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Peripheral IC Type:

Trade Compliance

A7001CMHN1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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