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74HCT640D,653

NXP Semiconductors

74HCT640D,653 by NXP Semiconductors

BUS TRANSCEIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

$0.341

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 277 parts In-Stock

1+ parts

$0.341

100+ parts

$0.321

1k+ parts

$0.290

10k+ parts

-

277

$0.341

$0.321

$0.290

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,030 parts In-Stock

1+ parts

$0.324

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-

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3,030

$0.324

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Vyrian

USA . 7,647 parts In-Stock

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7,647

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Anansix

USA . 1,237 parts In-Stock

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1,237

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Mentor Electronics Marketing, LLC

USA . 546 parts In-Stock

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546

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Distributors (Availability)

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Native Components

USA . 408 parts In-Stock

1+ parts

$0.149

100+ parts

-

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$0.143

408

$0.149

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-

$0.143

Northwest PG Solutions

USA . 901 parts In-Stock

1+ parts

$0.164

100+ parts

-

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$0.145

901

$0.164

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-

$0.145

Corphita

USA . 3,088 parts In-Stock

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$0.307

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3,088

$0.307

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Andel Nordic

Denmark . 1,244 parts In-Stock

1+ parts

$5.527

100+ parts

-

1k+ parts

$5.306

10k+ parts

$5.306

1,244

$5.527

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$5.306

$5.306

AZTECH Wire

Italy . 582 parts In-Stock

1+ parts

$8.290

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582

$8.290

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QUARKTWIN TECHNOLOGY LTD

USA . 16,745 parts In-Stock

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UNI Independent Distributors

Spain . 7,702 parts In-Stock

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Microchip USA

USA . 4,789 parts In-Stock

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Perfect Parts

USA . 60 parts In-Stock

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Technical Specifications

Bus Driver & Transceivers 74HCT640D,653 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

WITH DIRECTION CONTROL

Family:

HCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

33 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

74HCT640D,653 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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