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74HCT42D,652

NXP Semiconductors

74HCT42D,652 by NXP Semiconductors

DECIMAL DECODER/DRIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

$0.840

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 517 parts In-Stock

1+ parts

-

100+ parts

$0.825

1k+ parts

$0.684

10k+ parts

$0.610

517

-

$0.825

$0.684

$0.610

Verical

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

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$0.855

10k+ parts

$0.763

500

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-

$0.855

$0.763

Distributors (In-Stock)

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Digiode

USA . 4,252 parts In-Stock

1+ parts

$0.330

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$0.330

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Vyrian

USA . 7,381 parts In-Stock

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Anansix

USA . 396 parts In-Stock

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396

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J2 Sourcing AB

Sweden . 240 parts In-Stock

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240

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Distributors (Availability)

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Corphita

USA . 4,279 parts In-Stock

1+ parts

$0.312

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-

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4,279

$0.312

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Microchip USA

USA . 251 parts In-Stock

1+ parts

$6.478

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251

$6.478

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AZTECH Wire

Italy . 1,091 parts In-Stock

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$9.630

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1,091

$9.630

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QUARKTWIN TECHNOLOGY LTD

USA . 21,235 parts In-Stock

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UNI Independent Distributors

Spain . 7,347 parts In-Stock

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Northwest PG Solutions

USA . 2,170 parts In-Stock

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Robosynatics

Brazil . 1,424 parts In-Stock

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1,424

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Lucentia Tech

USA . 1,424 parts In-Stock

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$18.140

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$16.798

10k+ parts

$16.798

1,424

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$18.140

$16.798

$16.798

Native Components

USA . 943 parts In-Stock

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943

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Perfect Parts

USA . 864 parts In-Stock

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Technical Specifications

Decoder & Drivers 74HCT42D,652 attributes and parameters. Explore more Decoder & Drivers devices from NXP Semiconductors

Specs

Family:

HCT

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

44 ns

Propagation Delay (tpd):

53 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

74HCT42D,652 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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