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74HCT4052N,112

NXP Semiconductors

74HCT4052N,112 by NXP Semiconductors

NXP Semiconductors' 74HCT4052N,112 is a CMOS differential multiplexer with 4 channels. It operates at a supply voltage range of 1V to 5V and offers a max on-state resistance of 195 ohm. With a package style of IN-LINE, it is commonly used in automotive applications for signal switching tasks due to its low switch-on/off times and high isolation levels.

Median Price

$0.818

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Rochester

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Overview

Unlock the power of seamless signal routing with the NXP Semiconductors 74HCT4052N,112 differential multiplexer. Designed for automotive-grade performance, this versatile component features a compact IN-LINE package and dual-terminal position for easy integration. With a maximum on-state resistance of 195 ohms and a fast switch-on time of 72 ns, this multiplexer ensures reliable performance in a wide range of applications. Trust NXP Semiconductors for quality and innovation, and experience the value and precision this product brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the multiplexer, ensuring a longer lifespan.

Nominal Supply Voltage (Vsup): 4.5 V

The specified voltage ensures optimal performance and compatibility with a wide range of applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the multiplexer to function reliably in various environments, including automotive settings.

No. of Channels: 4

Having multiple channels allows for multiple inputs to be switched or multiplexed, increasing the versatility of the product.

Technology: CMOS

The CMOS technology offers low power consumption, fast switching speeds, and compatibility with a wide range of devices, making it an efficient choice.

Technical Specifications

Multiplexers & Switches 74HCT4052N,112 attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

19.05 mm

Maximum Negative Supply Voltage (Vsup):

-5 V

Minimum Negative Supply Voltage (Vsup):

-1 V

Nominal Negative Supply Voltage (Vsup):

-4.5 V

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

16

Nominal Off-state Isolation:

50 dB

Nominal On-state Resistance Match:

6 ohm

Maximum On-state Resistance (Ron):

195 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5,GND/-5

Qualification:

Not Qualified

Maximum Seated Height:

4.32 mm

Maximum Signal Current:

.025 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.16 mA

Maximum Supply Voltage (Vsup):

5 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

4.5 V

Surface Mount:

NO

Maximum Switch-off Time:

57 ns

Maximum Switch-on Time:

72 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

74HCT4052N,112 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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