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74HCT245N,652

NXP Semiconductors

74HCT245N,652 by NXP Semiconductors

NXP Semiconductors' 74HCT245N,652 is an 8-bit bus driver with a propagation delay of 33ns at 5V. It features a 3-STATE output and can handle up to 6A current. Ideal for bidirectional data transfer in automotive applications due to its common control feature and through-hole terminal form.

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Vyrian

USA . 6,809 parts In-Stock

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Digiode

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LIBRA Elektronik GmbH

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Inventory MP

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Bristol Electronics

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Nova Conductors

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J2 Sourcing AB

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ACDS - Activité Composants Distribution Service

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Connector Distribution Corp

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Right Parts Inc.

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Andel Nordic

Denmark . 3,564 parts In-Stock

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Corohmni

South Africa . 277 parts In-Stock

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Microchip USA

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Aztec Data Supply Inc.

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Semicontronic

India . 261 parts In-Stock

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AZTECH Wire

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Ampacity Inc.

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Perfect Parts

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Continental Prestige Electronics

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Argo Parts USA

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Bastille Electronics

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Overview

Elevate your electronic projects with the 74HCT245N,652 by NXP Semiconductors, a top-tier Bus Driver & Transceiver that delivers exceptional performance and reliability. With a focus on quality and innovation, NXP Semiconductors ensures that this product meets the highest standards in the industry. Whether you're working on automotive applications or need bidirectional control for your circuits, this true gem offers a seamless experience with its advanced features and impressive capabilities. Trust in NXP Semiconductors to bring value and efficiency to your designs with the 74HCT245N,652.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 33 ns

Low propagation delay ensures fast and efficient data transmission, making this Bus Driver & Transceiver ideal for high-speed applications.

No. of Bits: 8

Suitable for handling 8-bit data transfer, making it compatible with a wide range of systems and devices.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, ensuring compatibility with most electronics and power sources.

Output Characteristics: 3-STATE

3-state output allows for efficient control of the bus line, enabling multiple devices to share the same communication line without interference.

Temperature Grade: AUTOMOTIVE

With an automotive-grade temperature range, this product is suitable for use in vehicles and other extreme temperature environments.

Technical Specifications

Bus Driver & Transceivers 74HCT245N,652 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

HCT

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e4

Length:

26.73 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

33 ns

Propagation Delay (tpd):

33 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Translation:

N/A

Width:

7.62 mm

Trade Compliance

74HCT245N,652 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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