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74HCT1G02GV-Q100,125

NXP Semiconductors

74HCT1G02GV-Q100,125 by NXP Semiconductors

NXP Semiconductors' 74HCT1G02GV-Q100,125 is a CMOS Logic Gate with 2 inputs and 27ns propagation delay. AEC-Q100 screened for automotive applications, it operates b/w -40 to 125 °C at supply voltages of 4.5-5.5V. Ideal for compact designs with small outline package style and gull wing terminals.

Median Price

$0.057

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,900 parts In-Stock

1+ parts

$0.057

100+ parts

$0.054

1k+ parts

$0.049

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5,900

$0.057

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$0.049

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Distributors (In-Stock)

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Digiode

USA . 4,547 parts In-Stock

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$0.054

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4,547

$0.054

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Vyrian

USA . 8,490 parts In-Stock

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8,490

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DigiKey Marketplace

USA . 5,900 parts In-Stock

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Anansix

USA . 114 parts In-Stock

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114

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Distributors (Availability)

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Corphita

USA . 4,815 parts In-Stock

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$0.051

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-

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4,815

$0.051

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Component Stockers USA

USA . 4,160 parts In-Stock

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$0.060

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$0.050

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$0.050

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4,160

$0.060

$0.050

$0.050

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Microchip USA

USA . 2,832 parts In-Stock

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$0.390

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2,832

$0.390

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Native Components

USA . 553 parts In-Stock

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$0.469

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$0.450

553

$0.469

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$0.450

Northwest PG Solutions

USA . 338 parts In-Stock

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$0.516

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$0.455

338

$0.516

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$0.455

AZTECH Wire

Italy . 871 parts In-Stock

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$19.640

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871

$19.640

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Continental Prestige Electronics

USA . 5,900 parts In-Stock

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$0.072

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5,900

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UNI Independent Distributors

Spain . 2,187 parts In-Stock

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Overview

Elevate your automotive electronic designs with the high-quality 74HCT1G02GV-Q100,125 logic gate from NXP Semiconductors. This small outline, shrink pitch package offers fast propagation delay and a wide operating temperature range, making it ideal for a variety of automotive applications. Trust NXP's expertise in semiconductor manufacturing to deliver reliable and efficient components that will streamline your design process. Upgrade your projects today with the cutting-edge technology of NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the logic gate, ensuring long-lasting performance.

Surface Mount: YES

Easy to install and integrate into circuit boards, reducing installation time and effort.

Screening Level: AEC-Q100

AEC-Q100 screening ensures that the logic gate meets the rigorous automotive industry standards for reliability and quality.

Propagation Delay (tpd): 27 ns

Low propagation delay ensures fast signal processing, making this logic gate suitable for applications that require quick response times.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard supply voltage of 5V, making it compatible with a wide range of electronic systems.

Technical Specifications

Logic Gates 74HCT1G02GV-Q100,125 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G5

Length:

2.9 mm

Logic IC Type:

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Propagation Delay (tpd):

27 ns

Screening Level:

AEC-Q100

Maximum Seated Height:

1.9 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width:

1.5 mm

Trade Compliance

74HCT1G02GV-Q100,125 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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