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74HC4016N,652

NXP Semiconductors

74HC4016N,652 by NXP Semiconductors

SPST; Temperature Grade: AUTOMOTIVE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;

Median Price

$1.359

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,333 parts In-Stock

1+ parts

-

100+ parts

$1.280

1k+ parts

$1.150

10k+ parts

$1.080

5,333

-

$1.280

$1.150

$1.080

Verical

USA . 2,930 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.438

10k+ parts

$1.350

2,930

-

-

$1.438

$1.350

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,388 parts In-Stock

1+ parts

$0.700

100+ parts

-

1k+ parts

-

10k+ parts

-

3,388

$0.700

-

-

-

Vyrian

USA . 9,937 parts In-Stock

1+ parts

-

100+ parts

-

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9,937

-

-

-

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Anansix

USA . 2,069 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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2,069

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,492 parts In-Stock

1+ parts

$0.663

100+ parts

-

1k+ parts

-

10k+ parts

-

2,492

$0.663

-

-

-

Northwest PG Solutions

USA . 651 parts In-Stock

1+ parts

$3.330

100+ parts

-

1k+ parts

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10k+ parts

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651

$3.330

-

-

-

AZTECH Wire

Italy . 485 parts In-Stock

1+ parts

$20.390

100+ parts

-

1k+ parts

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10k+ parts

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485

$20.390

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 26,824 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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26,824

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UNI Independent Distributors

Spain . 5,787 parts In-Stock

1+ parts

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5,787

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Microchip USA

USA . 4,500 parts In-Stock

1+ parts

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4,500

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-

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Native Components

USA . 542 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.936

10k+ parts

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542

-

-

$2.936

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Technical Specifications

Multiplexers & Switches 74HC4016N,652 attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e4

Length:

19.025 mm

Nominal Negative Supply Voltage (Vsup):

0 V

Normal Position (V):

NO

No. of Channels:

1

No. of Functions:

4

No. of Terminals:

14

Nominal Off-state Isolation:

50 dB

Nominal On-state Resistance Match:

9 ohm

Maximum On-state Resistance (Ron):

170 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

9 V

Surface Mount:

NO

Maximum Switch-off Time:

22 ns

Maximum Switch-on Time:

28 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

74HC4016N,652 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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