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74HC2G126DP,125

NXP Semiconductors

74HC2G126DP,125 by NXP Semiconductors

BUS DRIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;

Median Price

$0.438

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 117 parts In-Stock

1+ parts

-

100+ parts

$0.438

1k+ parts

$0.363

10k+ parts

$0.324

117

-

$0.438

$0.363

$0.324

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,915 parts In-Stock

1+ parts

$0.175

100+ parts

-

1k+ parts

-

10k+ parts

-

2,915

$0.175

-

-

-

Chip Stock

USA . 160,000 parts In-Stock

1+ parts

-

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-

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160,000

-

-

-

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Vyrian

USA . 6,058 parts In-Stock

1+ parts

-

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6,058

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-

-

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Anansix

USA . 769 parts In-Stock

1+ parts

-

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769

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,212 parts In-Stock

1+ parts

$0.166

100+ parts

-

1k+ parts

-

10k+ parts

-

4,212

$0.166

-

-

-

Andel Nordic

Denmark . 2,500 parts In-Stock

1+ parts

$1.660

100+ parts

-

1k+ parts

$1.164

10k+ parts

$1.164

2,500

$1.660

-

$1.164

$1.164

Native Components

USA . 654 parts In-Stock

1+ parts

$6.520

100+ parts

-

1k+ parts

-

10k+ parts

-

654

$6.520

-

-

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AZTECH Wire

Italy . 1,022 parts In-Stock

1+ parts

$13.500

100+ parts

-

1k+ parts

-

10k+ parts

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1,022

$13.500

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-

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Microchip USA

USA . 1,329 parts In-Stock

1+ parts

-

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1,329

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UNI Independent Distributors

Spain . 774 parts In-Stock

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774

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Northwest PG Solutions

USA . 600 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$6.390

10k+ parts

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600

-

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$6.390

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Technical Specifications

Bus Driver & Transceivers 74HC2G126DP,125 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Control Type:

ENABLE HIGH

Family:

HC/UH

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

27 ns

Propagation Delay (tpd):

135 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

74HC2G126DP,125 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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